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Patent US4425205 - Process for regenerating electroless plating bath and a regenerating ... - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsA process for regenerating electroless plating bath comprising the steps of: (i) continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath from an electroless plating tank, followed by removing off the copper ion content from said bath;...http://www.google.com/patents/US4425205?utm_source=gb-gplus-sharePatent US4425205 - Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bathAdvanced Patent SearchTry the new Google Patents, with machine-classified Google Scholar results, and Japanese and South Korean patents.Publication numberUS4425205 APublication typeGrantApplication numberUS 06/372,133Publication dateJan 10, 1984Filing dateApr 27, 1982Priority dateMar 13, 1982Fee statusPaidAlso published asCA1220759A, CA1220759A1, DE3272286D1, EP0088852A1, EP0088852B1Publication number06372133, 372133, US 4425205 A, US 4425205A, US-A-4425205, US4425205 A, US4425205AInventorsHideo Honma, Yoshiaki Suzuki, Yasuhiro MatsumotoOriginal AssigneeKanto Kasei Co., Ltd., Facility Ltd.Export CitationBiBTeX, EndNote, RefManReferenced by (17), Classifications (7), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetProcess for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
US 4425205 AAbstract
A process for regenerating electroless plating bath comprising the steps of:
(i) continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath from an electroless plating tank, followed by removing off the copper ion content from said bath;
(ii) acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent;
(iii) supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane, and applying direct current between both electrode; and
(iv) then, recycling the solution within said anodic cell to said electroless plating tank, and a regenerating apparatus of electroless plating bath including
(a) a copper-precipitating means for decomposing the copper chelate contained in the electroless copper plating bath and for precipitating the copper ion,
(b) a chelating agent-recovering means for changing the pH of the solution to precipitate the chelating agent and recover, and
(c) an electrolytic means comprising an anodic cell and a cathodic cell separated by means of an ion exchange membrane, said anodic cell having a copper anode therein, said cathodic cell having a cathode therein.
1. A process for regenerating electroless plating bath comprising the steps of:(i) continuously or intermittently taking out a part or the whole chelating agent-containing copper electroless plating bath from an electroless plating tank, followed by removing off the copper ion content from said bath; (ii) acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent; (iii) supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane and applying direct current between both electrode; and (iv) then recycling the solution within said anodic cell to said electroless plating tank. 2. A process for regenerating electroless plating bath as claimed in claim 1, wherein the copper ion contained in said electroless copper plating bath is precipitated in the form of metal copper or copper oxide and thus removed out of said bath.
3. A process for regenerating electroless plating bath as claimed in claim 2, wherein said precipitation of copper ion is effected by adding metal copper in the electroless plating bath.
4. A process for regenerating electroless plating bath as claimed in claim 2, wherein the precipitation of copper ion is effected by alkalifying the electroless plating bath and adding metal copper thereto.
5. A process for regenerating electroless plating bath as claimed in claim 1, wherein the electroless plating bath is electrolyzed for depositing copper on a cathode and thus the copper ion is removed out of the electroless plating bath.
6. A process for regenerating electroless plating bath as claimed in claim 1, wherein said chelating agent is ethylenediaminetetraacetic acid, potassium sodium tartrate, ethylenediaminetetramine, triethanolamine or diethanolamine.
7. A process for regenerating electroless plating bath as claimed in claim 1, wherein the chelating agent is ethylenediaminetetraacetic acid.
8. A process for regenerating electroless plating bath as claimed in claim 7, wherein said ethylenediaminetetraacetic acid is precipitated by acidifying said solution up to pH 4.0 or less after removal of copper ion.
9. A process for regenerating electroless plating bath as claimed in claim 8, wherein said pH is in the order of 2.0 or less.
10. A process for regenerating electroless plating bath as claimed in claim 8, wherein the pH is in the order of 1.0 or less.
11. A process for regenerating electroless plating bath as claimed in claim 1, wherein the ion exchange membrane is an anion exchange membrane, and the cathodic cell is supplied with an alkaline electrolyte solution.
12. A process for regenerating electroless plating bath as claimed in claim 1, wherein the ion exchange membrane is a cation exchange membrane.
13. A process for regenerating electroless plating bath as claimed in claim 1, wherein the chelating agent is ethylenediaminetetraacetic acid; the solution after removal of the copper ion from the bath is acidified up to pH 2.0 or less so as to recover ethylenediaminetetraacetic acid by precipitation; and the anodic cell where copper is used as anode and the cathodic cell having cathode therein are partitioned by an anion exchange membrane, said cathodic cell being supplied with an alkaline solution, said anodic cell being supplied with the recovered ethylenediaminetetraacetic acid.
14. A process for regenerating electroless plating bath as claimed in claim 13, wherein the pH of the electrolyte solution contained in the anodic cell is in the order of 7.0 or more.
15. A process for regenerating electroless plating bath as claimed in claim 13, wherein the ethylenediaminetetraacetic acid is recovered by acidifying the solution after removal of the copper ion from the bath up to pH 1.0 or less.
16. A regenerating apparatus of electroless plating bath including(a) a copper-precipitating means for decomposing the copper chelate contained in the electroless copper plating bath and for precipitating the copper ion; (b) a chelating agent-recovering means for changing the pH of the solution to precipitate the chelating agent and recover; and (c) an electrolytic means for preparing copper chelate comprising an anodic cell for receiving the chelating agent recovered from the said chelating agent-recovering means and a cathodic cell separated by means of an ion exchange membrane, said anodic cell having a soluble anode of copper therein, said cathodic cell having a cathode therein. 17. A process for regenerating electroless plating bath as claimed in claim 1, wherein direct current is applied between both electrodes in the range of 0.5-4.0 A/dm2 of current density.
18. A process for regenerating electroless plating bath as claimed in claim 13, wherein direct current is applied between both electrodes in the range of 0.5-4.0 A/dm2 of current density.
19. A process for regenerating electroless plating bath comprising the steps of:(i) continuously or intermittently taking out a part or the whole ethylenediaminetetraacetic acid (EDTA)-containing copper electroless plating bath from an electroless plating tank, followed by removing off the copper ion content from said bath; (ii) acidifying the thus obtained solution for precipitating EDTA therefrom and recovering the precipitted chelating agent; (iii) supplying said recovered EDTA to an anodic cell separated by a cation exchange membrane from a cathodic cell having a cathode and an alkaline electrolyte solution therein, said anodic cell having a copper anode, wherein applying direct current between both electrodes; and (iv) then recycling the solution within said anodic cell to said electroless plating tank. 20. A process for regenerating electroless plating bath as claimed in claim 19, wherein EDTA is precipitated by acidifying said solution up to pH 2.0 or less after removal of copper ion.
21. A process for regenerating electroless plating bath as claimed in claim 19, wherein direct current is applied between both electrodes in the range of 0.5-4.0 A/dm2 of current density.
22. A regenerating apparatus of electroless plating bath, as claimed in claim 16, wherein said ion exchange membrane is a cation exchange membrane.
The present invention relates to a process for regenerating electroless plating bath containing a chelating agent such as ethylenediaminetetraacetic acid (EDTA) or the like and an apparatus therefor, in particular relates to a process for regenerating electroless plating bath which comprises supplying the copper ion resultant from anode dissolution in the form of an EDTA-copper complex by virtue of the chelating agent recovered from the plating bath and an apparatus used therefor.
Electroless plating, irrespective of whether it is used as the under-coating for electroplating or it is used by itself, is accompanied with accumulation of by-products in the plating bath resulting from the consumption of copper ion, pH modifier i.e. hydrate ion and reductant. This phenomenon should be said unavoidable because electroless plating reaction is an inversible reaction.
On the other hand, the quality of electroless copper plated film depends widely on the plating bath composition and the plating conditions. That is, with the increase of salt concentration due to the by-products in plating bath, the characteristics and quality of electroless copper plated film deteriorate and additionally the rate of plating reaction varies.
In the electroless copper plating for printed wiring board, in particular the printed wiring board prepared by semi-additive process or full-additive process, it is required that the resulting electroless plated film should possess exceedingly superior physical properties as compared with those of the electroless plated film, acting merely as only a conductive thin film for a through-hole, that is, prepared by conventional subtractive process wherein the through-hole and the circuits are mostly formed by electrolytic copper plating. That is to say, if the physical properties of electroless copper plated film are not equivalent to those of the copper film formed by electro plating, of which copper pyrophosphate plating bath and copper sulfate plating bath are typical, it will be impossible to obtain the printed wiring board equivalent in quality to that prepared by electro copper plating, and controlling of the deposition rate of electroless copper plating comes to be of great importance in the point of the control of the plated film feature. In view of this, it becomes necessary to control the electroless copper plating bath composition so as to maintain its concentration as uniform as possible and further to reduce reaction by-products as little as possible.
Controlling of bath concentration has hitherto been conducted by adding thereto separately prepared copper sulfate solution, sodium hydroxide solution and reductant such, for instance, as solid or liquid formaldehyde respectively in fixed quantities when the concentrations of components such as Cu2+, OH-, and reductant, which decrease with the progress of electroless plating reaction, in the bath are conjectured to have reached predetermined concentrations by manual or automatic analysis or from the treated mass of the substrate and times required for plating.
On the other hand, this comes to cause accumulation of sodium sulfate, sodium formate and further alcohols such as methanol, ethanol and the like. Taking account of the fact that the number of rejects of the plated products increases as these reaction by-products increase, it has been adopted by experience to disuse a part or the whole of the bath which has been used up to a certain bath life and use a fresh plating bath.
However, this way is defective in that it is not only expensive but also likely to bring about irregularity of the quality, deteriorated productivity and the like, and additionally involves problems to be settled especially when the electroless plated film of high quality as mentioned above is demanded. Further, the exchange of plating bath involves a problem on treatment of the spent bath. In more detail, at that time it becomes necessary to consider treatment for rendering the chelating agent contained in the spent bath nonpoisonous such, for instance, as COD counterplan, BOD counterplan and the like against the said chelating agent. Accordingly, it is feared that this way not only brings about increase of expenses for making the said chelating agent nonpoisonous but shall be unable to cope with the social circumstances where the disuse of spent bath per se is getting difficult from the viewpoint of environmental pollution regulation.
It is an object of the present invention to eliminate the above mentioned drawbacks inherent in the prior art and to provide a process for regenerating electroless plating bath which is capable of decreasing the accumulation of reaction by-products so as to carry out stable electroless plating and dealing with the problem of treating the spent bath solution widely and an apparatus therefor.
The process for regenerating electroless plating bath according to the present invention is characterized by comprising the following steps (i) to (iv):
(i) the step of continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath from an electroless plating tank, followed by removing off the copper ion content from said bath,
(ii) the step of acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent,
(iii) the step of supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane, and applying direct current between both electrode, and
(iv) the step of recycling the solution within said anodic cell to said electroless plating tank.
And, the regenerating apparatus of electroless plating bath is characterized by including the following means (a) to (c) as constitutional elements:
(a) a copper-precipitating means for decomposing copper chelate contained in the electroless copper plating bath and for precipitating the copper ion,
FIG. 1 is a flow view illustrating the present invention.
FIG. 2 is a graph illustrating the rate of recovery of EDTA.
FIG. 3 is a graph illustrating the relation between current density and the efficiency of anode dissolution.
FIG. 4 is a graph illustrating the relation between the concentration ratio R of copper ion to EDTA and the efficiency of anode dissolution.
FIG. 5 is a graph illustrating the relation between the anodic electlyte temperature and the anode efficiency.
12 . . . electroless plating bath
21 . . . copper-precipitating device
27 . . . chelating agent-recovering device
31 . . . electrolytic device
37 . . . ion-exchange membrane
39 . . . anode
41 . . . cathode
FIG. 1 is a flow view of the present invention. An electroless plating bath 12 may contain copper ion, hydrate ion (pH modifier), reductant and chelating agent, and further may contain various assistants. With the progress of electroless copper plating, the copper ion, hydrate ion and reductant are consumed, while sodium formate and methyl alcohol (in case formaldehyde is used as reductant) are by-produced. And, in case copper ion is added as copper sulfate and hydrate ion is added as sodium hydroxide, sodium sulfate comes to accumulate. Thereafter, the consumed quantity is supplied from a cycling system and a non-cycling system through lines 13 and 15 respectively, and simultaneously a part or the whole of plating bath (containing by-products) is taken out of the plating tank 11 continuously or intermittently. The term "intermittently" used herein includes a case of taking out the plating bath irregularly irrespective of a predetermined cycle.
FIG. 1 shows the instance where a part of the plating bath is taken out continuously by overflowing in accordance with the supplied quantity. The plating bath taken out by overflowing passes along a line 17 and is introduced in a copper-precipitating device 21 from an inlet via a filter 19 (which is omissible). In the copper-precipitating device 21, the copper ion is precipitated and removed. Separation of the copper ion may be conducted by decomposing the copper chelate and precipitating the copper in the form of metal copper or copper oxide according to one of the following methods or a combination of two or more thereof:
(1) adding metal copper in the form of copper plate, copper foil, copper powder or the like in the bath,
(2) adding a catalyst such as Pd2+ or the like in the bath, and
(3) maintaining the bath at a high temperature and a high pH.
Removal of copper may be achieved by electrolytic removal besides above mentioned precipitating removal. The copper ion contained in said bath may be removed therefrom, for instance, in the manner of having insoluble anode and cathode in the electroless copper plating liquid to be treated and applying direct current for depositing the copper on the cathode.
Accordingly, the copper-precipitating device 21 may include, by request, a member for pouring copper powder, Pd2+, alkali agent and the like or a member for heating them and may further include a member for stirring them in order to accelerate the above reaction. In addition, it is possible to have anode and cathode in the copper-precipitating device 21. The thus precipitated copper is discharged from a valve 24 as the occasion may demand.
The thus obtained solution, from which the copper ion has been precipitated and removed, passes through an outlet and is introduced in a chelating agent-recovering device 27 through a line 23 via a filter 25 (which is omissible). An acid can be introduced in the chelating agent-recovering device through a line 28 so as to render the pH of the solution within this device acidic enough to precipitate the chelating agent therefrom. The suitable pH range, although variable depending on the chelating agent, is generally 4.0 or less for instance when the chelating agent is EDTA, preferably 2.0 or less, more preferably 1.0 or less. Usual acids may be employed for the purpose of controlling the pH. As said acids there can be enumerated sulfuric acid, hydrochloric acid and the like.
FIG. 2 is a graph illustrating the relation between the rate of recovery and pH in the case of having used EDTA as the chelating agent. It can be seen therefrom that EDTA can be recovered fully at the pH of 2.0 or less, and more preferable recovery can be achieved at the pH of 1.0 or less. In this connection, it is to be noted that controlling of pH has been done with sulfuric acid in the present instance.
As is evident from the above stated, separation of the chelating agent from the electroless copper plating bath can be achieved by decomposing the copper chelating agent to thereby remove the copper content and removing the chelating agent. As the chelating agent applicable to this process there can be enumerated, in addition to EDTA, many known ones for use in electroless copper plating such as potassium sodium tartrate (Rochelle salt), ethylenediaminetetramine, triethanolamine, diethanolamine and the like.
The recovered chelating agent is introduced through a line 29 into an anodic cell 33 of an electrolytic device 31. In this instance, the chelating agent may be washed and further dried as occasion demands. Further, the recovered chelating agent may be supplied to the anodic cell 33 in a solid state, and may also be introduced to the anodic cell 33 of the electrolytic device 31 in the state of solution having previously been dissolved in an alkali solution.
The electrolytic device 31 comprises the anodic cell 33 and cathodic cell 35 partitioned by means of an ion exchange membrane 37. And, in the anodic cell 33 there is disposed a copper anode 39, while in the cathodic cell 35 there is disposed a cathode 41. The cathode 41 is preferably made of the material to be insoluble in a cathodic electlyte, such as stainless, carbon or the like.
In the anodic cell 33 there is supplied the recovered chelating agent in the solid or liquid state. Its pH is maintained at such a value that the chelating agent is soluble in the solution in the anodic cell 33, or anodic electlyte. For instance, in the case of EDTA the pH value is generally 4.0 or more, preferably 7.0 or more.
The cathodic cell 35 may contain an alkaline, neutral or acidic electrolyte solution. In case a neutral or alkaline electrolyte solution is supplied into the cathodic cell 35; the partitioning membrane 37 may be either an anion exchange membrane or a cation exchange membrane, while in case an acidic electrolyte solution is supplied into the cathodic cell 35, the partitioning membrane 37 is a cation exchange membrane. Conversely speaking, when the ion exchange membrane 37 is cathodic, the electrolyte solution contained in the cathodic cell 35 may be either alkaline, neutral or acidic, while when the membrane 37 is anodic, the electrolyte solution is neutral or alkaline.
When electrolysis is carried out by applying direct current between both electrodes, namely between anode 39 and cathode 41, the copper is subjected to anodic dissolution and the copper ion is generated in the anodic cell 33. At the same time, this ion forms a copper complex compound in conjunction with a chelating agent supplied through a line 29. In succession, this copper complex compound is recycled from a line 13 to an electroless plating tank 11. The current density may be generally in the range of 0.01 to 100 A/dm2.
In case the pH of solution within the cathodic cell 35 is alkaline and an anion exchange membrane is used, with the progress of electrolysis the OH- ion passes through the ion exchange membrane 37 (anion exchange membrane) and arrives at the anodic cell 33, and consequently the consumed copper ion (in the form of a complex compound) and hydrate ion are supplied into the plating tank 11 through the line 13. This case is very convenient in that the hydrate ion necessary for electroless plating is supplied together with the copper ion. While a cation exchange membrane is commercially more available than and anion one.
In case the pH of solution within the cathodic cell 35 is acidic or neutral, or the ion exchange membrane 37 is cathodic, there is no OH-ion to be supplied from said cell. Although there is necessity of supplying it separately, it may be readily supplied in the form of NaOH or the like.
As is evident from the above mentioned, the copper ion (in the form of a complex) or further the OH- ion is supplied from the line 13, and the reductant and the required assistants are supplied from the line 15 or 15' through the line 13. The above explanation was made on the case where separation of copper ion, recovery of chelating agent, and dissolution of copper ion by electrolysis are operated in separate tanks. However, it is to be noted that the above mentioned respective operations may be done in one tank.
FIG. 3 a graph illustrating the relation between the current density and efficiency of anode dissolution. This was effected at 50� C. of liquid temperature by using the electrolytic device illustrated in FIG. 1 in which the ion exchange membrane is an anion exchange membrane, pouring 0.08 mol/l of EDTA. 4 Na in the anodic cell and 0.1 mol/l of NaOH in the cathodic cell and using 0.5 dm2 of copper plate as the anode and 0.5 dm2 of 18-8 stainless as the cathode.
FIG. 4 is a graph illustrating the relation between the concentration ratio R of copper ion to EDTA (R=[EDTA]/[Cu2+ ]) and the efficiency of anode dissolution. This was effected according to the exactly same procedure as in FIG. 3 except that the concentration of EDTA was varied. It can be seen therefrom that in case the concentration of EDTA, the chelating agent for copper, is high, the copper dissolves so much with high current efficiency. Accordingly, dissolution and supply of the copper can be effected with high efficiency by maintaining the pH of the chelating agent more than the predetermined value.
FIG. 5 is a graph illustrating the relation between the liquid temperature in the anodic cell and the efficiency of anode dissolution. This was conducted under the conditions: both cell compositions identical with those in FIG. 2, current strength 2A, quantity of electricity applied 3600 coulombs, anodic current density 3A/dm2, and cathodic current density 4A/cm2. It can be seen therefrom that in case the liquid temperature in the anodic cell is higher, the copper dissolves with so much higher current efficiency. Accordingly, the present invention is more effective in the preparation of, for instance, printed wiring boards using electroless plating. The reason is that in the electroless plating where high plating speed and physical properties of plated film are demanded strictly, it is ideal to use the plating bath under exceedingly high temperature conditions.
Experiments were accomplished on efficiency of anode dissolution using other combinations of an ion exchange membrane and an electrolyte solution contained in the cathodic cell, that is, a cation exchange membrane and an acidic, neutral or alkaline electrolyte solution as well as an anion exchange membrane and a neutral electrolyte solution, obtaining the result similar to that showed FIGS. 3 to 5.
As explained above, the present invention, which comprises taking out at least a part of the electroless plating bath from an electroless plating tank, recovering the chelating agent therefrom and supplying the consumed copper portion in the form of the copper complex compound by means of this recovered chelating agent, can markedly reduce the accumulation of the by-products such as sodium sulfate, sodium formate and alcohols in the electroless copper plating bath, in the extreme the accumulation of sodium sulfate being substantially reduced into zero, whereby the life of the electroless plating bath can be prolonged very much and high quality electroless plating film can be obtained stably. In the prior art, the COD and BOD counterplanes of waste plating bath have brought about serious environmental pollution problems. According to the present invention, contrarily, the plating bath life is prolonged, which dispenses with disuse of the bath and further makes it possible to recover precious chelating agents such as EDTA and reutilize them effectively.
______________________________________EDTA.4Na            30 g/lCuSO4.5H2 O                6 g/lPara-formaldehyde    7 g/lpH (controlled with NaOH)               11.8______________________________________
Glass-epoxy copper-clad laminates were electroless-plated by using the above prescribed bath composition (bath volume; 5 l) at 50� C. At this time, sodium sulfate was added to the bath in quantities as shown in Table 1 to observe the influence caused thereby.
TABLE 1______________________________________Quantity of    Rate of   Crack-Na2 SO4.5H2 O          deposition                    forming rateadded          (μm/hr)                    G 10______________________________________ 0 [g/l]       2.9        0/3015 [g/l]       3.3        7/1545 [g/l]       3.5       15/1575 [g/l]       3.9       15/15______________________________________
It can be seen from Table 1 that the rate of deposition varies depending on the quantities of sodium sulfate added and that the crack-forming rate increases as the quantities of sodium sulfate increase.
Glass-epoxy copper-clad laminates were defatted with 40 g/l of sodium trihydrogen phosphate, etched with 100 g/l of ammonium persulfate, activated with a colloidal solution of palladium and tin and then with 50 g/l of sulfuric acid, and thereafter electroless-plated at a load of 1 dm2 / l for 12 days in accordance with the present process and the conventional one under the following conditions:
______________________________________Bath compositioncopper sulfate   10 g/lEDTA             50 g/lFormaldehyde     10 g/lSodium hydroxide pH controlled to be 12Bath temperature 50� C.______________________________________
In the conventional process, the supply of copper ion and hydrate ion was effected in the manner of supplementing copper sulfate and sodium hydroxide, whereby the concentration of sodium sulfate increased. The process of the present invention was carried out in the manner of using the system shown in FIG. 1, using an anion exchange membrane employing the plating bath of above composition, putting 0.1 g/l of NaOH in the cathodic cell of the electrolytic apparatus, using a copper plate as the anode and a stainless plate as the cathode, applying electricity at the anodic current density of 2.5 A/dm2 and cathodic current density of 4 A/dm2 and supplying recovered EDTA to the anodic cell. However, there could be observed no increase in the concentration of sodium sulfate.
EDTA was recovered by taking out a part of the plating bath, controlling the pH to be 14 and adding copper foil thereto so as to deposit the copper ion and remove, then adding H2 SO4 to the filtrate so as to control the pH to be 2.0 and precipitate EDTA quantitatively, and filtering.
The thus obtained results are as shown hereinafter.
______________________________________Concentration ofNa2 SO4       Conventional process                      Our process______________________________________Comparison of the corner-cracking on solderingOriginal    0%             0%0.1 M/l     40-50%         Original physical0.3 M/l     90-100%        properties are                      held because                      Na2 SO4 does not                      increaseElectroless-copper depositionon the surface of the non-catalytic areaOriginal    No             No       deposition     deposition       observed       observed0.1 M/l     Deposition     Original physical       observed       properties are       around the     held because       land           Na2 SO4 does not0.3 M/l     Deposition     increase       observed on       soldar-       resistExternal appearance (depositing state or the like)Original    Deposition is fine,                      Deposition is fine,       glossy and uniform                      glossy and uniform0.1 M/l     Deposition becomes                      Original physical       coarse and gloss                      properties are       deteriorates   held because0.3 M/l     Deposition becomes                      Na2 SO4 does not       more coarse and                      increase       lacks uniformityDuctility (60 � 10 � 0.05t mm)Original 004       9-10%          9-10%0.1 M/l     5- 6%          Original physical0.3 M/l     1-2%           properties are                      held because                      Na2 SO4 does not                      increaseTensile strength (60 � 10 � 0.05t mm)Original    53 Kg/mm2 53 Kg/mm20.1 M/l     37 Kg/mm2 Original physical0.3 M/l     24 Kg/mm2 properties are                      held because                      Na2 SO4 does not                      increase______________________________________
Referenced byCiting PatentFiling datePublication dateApplicantTitleUS4549946 *May 9, 1984Oct 29, 1985Electrochem International, Inc.Process and an electrodialytic cell for electrodialytically regenerating a spent electroless copper plating bathUS4600493 *Jan 14, 1985Jul 15, 1986Morton Thiokol, Inc.Electrodialysis apparatus for the chemical maintenance of electroless copper plating bathsUS4671861 *Mar 31, 1986Jun 9, 1987Morton Thiokol, Inc.Measurement and control of net caustic production during electrodialysisUS4734175 *Apr 2, 1987Mar 29, 1988International Business Machines CorporationProcess for regenerating an electroless copper plating bathUS4752373 *Apr 8, 1986Jun 21, 1988Morton Thiokol, Inc.Electrodialysis apparatus for the chemical maintenance of electroless copper plating bathsUS4956097 *Oct 12, 1989Sep 11, 1990Enthone, IncorporatedWaste treatment of metal containing solutionsUS5091070 *Aug 30, 1990Feb 25, 1992International Business Machines CorporationMethod of continuously removing and obtaining ethylene diamine tetracetic acid (edta) from the process water of electroless copper platingUS5211831 *Nov 27, 1991May 18, 1993Mcgean-Rohco, Inc.Process for extending the life of a displacement plating bathUS5230782 *Jul 22, 1991Jul 27, 1993International Business Machines CorporationElectrolytic process for reducing the organic content of an aqueous composition and apparatus thereforeUS6338787 *Apr 5, 2000Jan 15, 2002Daiwa Fine Chemicals Co., Ltd.Redox system electroless plating methodUS6733679 *Nov 6, 2001May 11, 2004Intel CorporationMethod of treating an electroless plating wasteUS6852210Jan 7, 2002Feb 8, 2005Daiwa Fine Chemicals Co., Ltd.Plating method and plating bath precursor used thereforUS7601264Oct 13, 2009Applied Materials, Inc.Method for treatment of plating solutionsUS20030085177 *Nov 6, 2001May 8, 2003Dubin Valery M.Method of treating an electroless plating wasteUS20050252684 *Apr 25, 2005Nov 17, 2005Takeyiki ItabashiElectroless copper plating machine thereof, and multi-layer printed wiring boardUS20080083623 *Oct 4, 2006Apr 10, 2008Golden Josh HMethod and apparatus for treatment of plating solutionsUS20080083673 *Oct 4, 2006Apr 10, 2008Golden Josh HMethod and apparatus for treatment of plating solutions* Cited by examinerClassifications U.S. Classification205/702, 204/DIG.13, 205/703International ClassificationC23C18/16Cooperative ClassificationY10S204/13, C23C18/1617European ClassificationC23C18/16B4Legal EventsDateCodeEventDescriptionApr 27, 1982ASAssignmentOwner name: FACILITY LTD. NO. 635, KAWAWA-CHO, MIDORI-KU, YOKOFree format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:HONMA, HIDEO;SUZUKI, YOSHIAKI;MATSUMOTO, YASUHIRO;REEL/FRAME:003997/0544Effective date: 19820424Owner name: KANTO KASEI CO., LTD. NO. 73, IKEDA-CHO 4-CHOME, YFree format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:HONMA, HIDEO;SUZUKI, YOSHIAKI;MATSUMOTO, YASUHIRO;REEL/FRAME:003997/0544Effective date: 19820424Jun 11, 1987FPAYFee paymentYear of fee payment: 4Jun 20, 1991FPAYFee paymentYear of fee payment: 8Jun 13, 1995FPAYFee paymentYear of fee payment: 12RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services


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Terrible! - Review of The RainTree, Lake George, NY - TripAdvisor
Terrible! - The RainTree
Restaurant details Good for: Romantic, Local cuisine, Bar scene, Families with children, Special occasions, Large groups Dining options: Dinner, Late Night, Lunch, Full Bar, Outdoor Seating, Parking Available, Reservations, Seating, Serves Alcohol, Takeout, Television, Waitstaff There are newer reviews for this restaurant
Although our waitress was very friendly, the food was terrible! I have never seen or ate greasy ribs! They were disgusting.. The bruschetta was soooooo bland. The steak was dry and no flavor. It's a shame because the staff was very accomodating!
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English first Spanish first Any jillr162
8 helpful votes “Great place for family.”
Finally a place to take our 3 teenagers out to dinner in Lake George without breaking the bank. Good, American food, nice size portions, at a refreshingly reasonable price.
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This review is the subjective opinion of a TripAdvisor member and not of TripAdvisor LLC. DrGRS
6 helpful votes “New design questionable”
We have been going to The Rain Tree for years. It has undergone many changes but the food has always been good. The ne wlayout with the bar in the middle of what used to be the dining room did not work for us and, at least for families, send the message that its a bar with a small restaurant. Not good for us.
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This review is the subjective opinion of a TripAdvisor member and not of TripAdvisor LLC. Sema001
2 helpful votes “Nice place for a relaxing meal”
Food was just ok but our waitress was a hoot! She made some recommendations that turned out to be great choices. My husband was disappointed though with his sausage and pepper sandwich. He is used to links of sausage and this came out as a tiny little patty with hardly any peppers and onions. The bar was nice though..big screen TVs all around so we could check on the olympic action.
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2 reviews 1 helpful vote “Not my favorite”
They need to improve the taste of their food so bad, simply not good. I ordered a stake and it had no taste, so i ate very little of it and took it home to cook it myself, which came much better. My wife ordered a taco and was just terrible. My impression is that they already gave up on this place. I am sure they could improve it if they really want to.
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Patent US7637957 - System and method for motion-controlled foot unit - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsA system and method associated with the movement of a limb. In one example, the system, such as a prosthetic or orthotic system, includes an actuator that actively controls, or adjusts, the angle between a foot unit and a lower limb member. A processing module may control movement of the actuator based...http://www.google.com/patents/US7637957?utm_source=gb-gplus-sharePatent US7637957 - System and method for motion-controlled foot unitAdvanced Patent SearchPublication numberUS7637957 B2Publication typeGrantApplication numberUS 12/117,633Publication dateDec 29, 2009Filing dateMay 8, 2008Priority dateFeb 12, 2004Fee statusPaidAlso published asCA2556041A1, CN1929797A, CN1929797B, EP1718252A2, EP2564817A2, EP2564817A3, US7431737, US7811334, US20050192677, US20050197717, US20080215161, US20110106274, WO2005079712A2, WO2005079712A3Publication number117633, 12117633, US 7637957 B2, US 7637957B2, US-B2-7637957, US7637957 B2, US7637957B2InventorsHeidrun G. Ragnarsdottir, Arinbjorn V. Clausen, Hjordis Thorhallsdottir, Helgi JonssonOriginal Assignee�ssur hfExport CitationBiBTeX, EndNote, RefManPatent Citations (102), Non-Patent Citations (18), Referenced by (6), Classifications (29), Legal Events (1) External Links: USPTO, USPTO Assignment, EspacenetSystem and method for motion-controlled foot unitUS 7637957 B2Abstract A system and method associated with the movement of a limb. In one example, the system, such as a prosthetic or orthotic system, includes an actuator that actively controls, or adjusts, the angle between a foot unit and a lower limb member. A processing module may control movement of the actuator based on data obtained from a sensor module. For instance, sensing module data may include information relating to the gait of a user and may be used to adjust the foot unit to substantially mimic the movement of a natural, healthy ankle. The system may further accommodate, for example, level ground walking, traveling up/down stairs, traveling up/down sloped surfaces, and various other user movements. In addition, the processing module may receive user input or display output signals through an external interface. For example, the processing module may receive a heel height input from the user.
RELATED APPLICATIONS The present application is a divisional of U.S. application Ser. No. 11/057,391, filed Feb. 11, 2005, and entitled SYSTEM AND METHOD FOR MOTION-CONTROLLED FOOT UNIT, now U.S. Pat. No. 7,431,737, issued Oct. 7, 2008, which claims the benefit of priority under 35 U.S.C. � 119(e) of U.S. Provisional Application No. 60/544,259, filed Feb. 12, 2004, and entitled �LOWER LIMB PROSTHESIS WITH ANKLE-MOTION-CONTROLLED FOOT,� and of U.S. Provisional Application No. 60/588,232, filed Jul. 15, 2004, and entitled �PROSTHETIC OR ORTHOTIC SYSTEM WITH ANKLE-MOTION-CONTROLLED FOOT,� each of which is incorporated herein by reference in its entirety and is to be considered a part of this specification.
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A. Blatchford & Sons LimitedProsthesis control systemUS5895430Feb 6, 1998Apr 20, 1999O'connor; Roderick S.Prosthesis for long femur and knee disarticulation amputationUS5919149Mar 14, 1997Jul 6, 1999Allum; John H.Method and apparatus for angular position and velocity based determination of body sway for the diagnosis and rehabilitation of balance and gait disordersUS5955667Oct 14, 1997Sep 21, 1999Governors Of The University Of AlbertaMotion analysis systemUS5957981Feb 19, 1996Sep 28, 1999Gramtec Innovation AbAdjustable prosthesis jointUS5972035Apr 15, 1997Oct 26, 1999Chas. A. Blatchford & Sons, LimitedSpecification of an artificial limbUS5982156Apr 15, 1997Nov 9, 1999The United States Of America As Represented By The Secretary Of The Air ForceFeed-forward control of aircraft bus dc boost converterUS5998930Oct 24, 1996Dec 7, 1999Motorola Inc.Electronic ballast with two-step boost converter and methodUS6007582Jul 25, 1997Dec 28, 1999Ortho Europe LimitedProsthetic foot with means for energy storage and releaseUS6061577Dec 19, 1995May 9, 2000AlcatelElectrical power supply circuit, in particular for portable appliancesUS6091977Oct 5, 1998Jul 18, 2000The University Of MiamiSensorUS6113642Nov 10, 1998Sep 5, 2000Mauch, Inc.Computer controlled hydraulic resistance device for a prosthesis and other apparatusUS6129766May 29, 1998Oct 10, 2000College Park Industries, Inc.Prosthetic foot assembly having improved resilient cushions and componentsUS6165226Jun 18, 1998Dec 26, 2000Otto Bock Orthopaedische Industrie Besitz- Und Verwaltungs- KommanditgesellschaftOrthosis jointUS6183425Oct 13, 1995Feb 6, 2001The United States Of America As Represented By The Administrator Of The National Aeronautics And Space AdministrationMethod and apparatus for monitoring of daily activity in terms of ground reaction forcesUS6187051Sep 8, 1998Feb 13, 2001Otto Bock Orthopadische Industrie Besitz-Und Verwaltungs-KommanditgesesllschaftPivot device between parts of an orthopedic aidUS6195921Sep 28, 1999Mar 6, 2001Vinncente Hoa Gia TruongVirtual intelligence shoe with a podiatric analysis systemUS6206932Nov 24, 1998Mar 27, 2001Timothy JohnsonAlignment device for a prosthetic limbUS6206934Aug 21, 1998Mar 27, 2001Flex-Foot, Inc.Ankle block with spring insertsUS6241775May 25, 1999Jun 5, 2001Chas. A. Blatchford & Sons Ltd.Specification of an artificial limbUS6301964Jul 6, 1999Oct 16, 2001Dyhastream Innovations Inc.Motion analysis systemUS6350286Aug 5, 1999Feb 26, 2002Seattle Orthopedic Group, Inc.Prosthetic ankle and walking systemUS6361570Oct 26, 1998Mar 26, 2002Lothian Primary Care Nhs TrustUpper limb prosthesisUS6373152Feb 9, 2000Apr 16, 2002Synergy Scientech Corp.Electrical energy storage deviceUS6409695Jul 27, 1999Jun 25, 2002John D. ConnellyAnkle-foot orthoticUS6423098Dec 10, 1998Jul 23, 2002Biedermann Motech GmbhLeg prosthesis with an artificial knee joint provided with an adjustment deviceUS6425925Oct 1, 1999Jul 30, 2002Sch�tt & Grundei Orthop�dietechnik GmbHLeg exoprosthesis for adaptation to a thigh stumpUS6430843Apr 18, 2000Aug 13, 2002Nike, Inc.Dynamically-controlled cushioning system for an article of footwearUS6436149Aug 27, 1996Aug 20, 2002Richard G. RincoeArtificial ankle joint and prosthetic devices formed therewithUS6443993Mar 23, 2001Sep 3, 2002Wayne KoniukSelf-adjusting prosthetic ankle apparatusUS6443995Dec 22, 2000Sep 3, 2002Barry W. TownsendProsthetic footUS6451481Mar 6, 2000Sep 17, 2002Samsung Sdi Co., Ltd.Lithium polymer batteryUS20040064195 *Jul 3, 2003Apr 1, 2004Hugh HerrVariable-mechanical-impedance artificial legsUS20060122710 *Nov 9, 2005Jun 8, 2006Stephane BedardControl device and system for controlling an actuated prosthesis* Cited by examinerNon-Patent CitationsReference1Au S K et al., "An EMG-Position Controlled System for an Active Ankle-Foot Prosthesis: An Initial Experimental Study" Rehabilitation Robotics, 2005. ICORR 2005., 9th International Conference in Chicago, IL, USA Jun. 28-Jul. 1, 2005, Piscataway, NJ, IEEE, Jun. 28, 2005, pp. 375-379, XP008078417.2Aug. 16, 2007 Office Action fr co-pending U.S. Appl. No. 11/057,391, filed Feb. 11, 2005.3Blaya, J. A., et al., "Adaptive Control of a Variable-Impedance Ankle-Foot Orthosis to Assist Drop-Foot Gait" IEEE Transactions on Neural Systems and Rehabilitation Engineering, vol. 12, No. 1, Mar. 2004, pp. 24-31.4Copes/Bionic Ankle, The Most Significant Development in Ankle Prosthetics in Over a Half Century, 1985.5Dietl, H. Bargehr, Der Einsatz von Elektronik bei Prothesen zur Versorgung der unteren Extremitat, Med. Orth. Tech. 117 1997, pp. 31-35.6Flowers, et al., Journal of Biomechanical Engineering: Transactions of the ASME; Feb. 1977, pp. 3-8.7Mar. 21, 2007 Office Action fr co-pending U.S. Appl. No. 11/057,391, filed Feb. 11, 2005.8Mar. 31, 2006 OA from co-pending U.S. Appl. No. 11/057,391, System and Method for Motion-Controlled Foot Unit, filed Feb. 11, 2005.9Office Action dated Feb. 6, 2006 in Chinese Patent Application No. 200580008119.2.10PCT International Preliminary Report on Patentability for App. No. PCT/US2007/005292 dated Sep. 12, 2008.11PCT International Search Report and Written Opinion mailed Aug. 19, 2005, Appl. No. PCT/US2005/004878, 15 pages.12PROTEOR, Assembly and Adjustment Instructions for 1P50-R, pp. 1-21, Sep. 2004.13Response to Apr. 8, 2009 Final Office Action dated Jul. 17, 2009 in co-pending U.S. Appl. No. 11/056,344, filed Feb. 11, 2005.14Sep. 27, 2006 Office Action from co-pending U.S. Appl. No. 11/057,391, filed Feb. 11, 2005.15Suga, T., et al., "Newly designed computer controlled knee-ankle-foot orthosis (Intellegent Orthosis)", Prostetics and Orthotics International, 1998, 22, 230-239.16Townsend M A et al., "Biomechanics and modeling of bipedal climbing and descending." Journal of Biomechanics 1976, vol. 9, No. 4, pp. 227-239, XP008078405.17U.S. Appl. No. 11/367,048, filed Mar. 1, 2006.18US Appl. No. 11/367,049, filed Mar. 1, 2006.Referenced byCiting PatentFiling datePublication dateApplicantTitleUS7998221 *Jul 24, 2009Aug 16, 2011�ssur hfFoot prosthesis with resilient multi-axial ankleUS8025699 *Jul 24, 2009Sep 27, 2011�ssur hfFoot prosthesis with resilient multi-axial ankleUS8211042Jan 7, 2008Jul 3, 2012Victom Human Bionics Inc.High torque active mechanism for orthotic and/or prosthetic devicesUS8231687Nov 29, 2005Jul 31, 2012Victhom Human Bionics, Inc.Actuated leg prosthesis for above-knee amputeesUS8435309Jan 7, 2008May 7, 2013Victhom Human BionicsJoint actuation mechanism for a prosthetic and/or orthotic device having a compliant transmissionUS8480760Apr 12, 2011Jul 9, 2013Northwestern UniversityPassive ankle-foot prosthesis and orthosis capable of automatic adaptation to sloped walking surfaces and method of use* Cited by examinerClassifications U.S. Classification623/24, 623/50, 623/47International ClassificationA61F2/48, A61F2/72, A61F2/68, A61F2/76, A61F2/70, A61F2/24, A61F5/052, A61F2/50, A61F2/66Cooperative ClassificationA61F2002/7645, A61F2002/6685, A61F2/68, A61F2002/705, A61F2/72, A61F2002/764, A61F2013/00455, A61F2002/7635, A61F2002/701, A61F2002/5073, A61F2/6607, A61F2002/5018, A61F2/66, A61F2002/704, A61F2002/6642European ClassificationA61F2/68, A61F2/66Legal EventsDateCodeEventDescriptionJan 14, 2013FPAYFee paymentYear of fee payment: 4RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google

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Top 10 Stanley Hotels Near Stanley Station | North Dakota | Hotels.comEnglish (United States)Book online or call 800-246-8357This call is free. 24 hours a day; 7 days a week.HotelsHotel DealsPackages & FlightsGroupsGift CardsHelpWebsite feedbackSign in & AccountSign inCreate an accountYour bookingsReview a hotelHotels.com® RewardsYour bookingsHotelsHotels in United States of AmericaHotels in North DakotaStanley HotelsHotels near Stanley Station, StanleyHotels near Stanley StationSearch hotels near Stanley Station in StanleyCity, landmark, hotel name, address or zip codeCheck inCheck out I don’t know my datesRooms123456789+Room 1:Adults12345678Aged 18+Children01230-17Age at check in:Child 1:-?-<11234567891011121314151617Show dealsGet Secret Prices on select hotelsThese prices aren’t available to everyone.Unlock nowDeal of the dayMicrotel Inn & Suites by Wyndham Stanley from $76See all Stanley dealsTrending now in StanleyHotels within 0.5 miles of Stanley StationMost bookedMicrotel Inn & Suites by Wyndham StanleyExcellent 4.0 / 5( 29 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 9 people looked at this hotel in the last hourMost recent review"We got a great room that was convenient to an exit and the front desk. The staff went out of their way to b helpful and friendly. Overall a wonderful place to stay.
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Better Fit - West Virginia - Scout
Better FitKevin Kinder12/19/2009Even when Bruce Irvin committed to Tennessee, he kept West Virginia in his thoughts. That state of mind, aided by some conversations with the Mountaineer coaching staff, led him to switch his allegiance to West Virginia.
"There were a few things that led to me committing to West Virginia," said Bruce Irvin, a five star defensive end prospect from Mt. San Antonio College in Walnut, Calif. "A lot of it was Coach Lonnie Galloway and the scheme that they run. Then there's the tradition of the program – it was all pretty much the best fit for me.
"I met Coach Galloway about a year and half ago, and I told him to just keep an eye on me. He did that, and he kept in contact with me, and when I had some film to back up what I was telling him about myself, I sent it in and told him that now he could see. They offered me, but I committed to Tennessee.
"Even when that happened, he still stayed in contact with me. He didn't negatively recruit against Tennessee, or say anything bad about them. He just kept checking in with me to find out how I was doing and how my family was, and things like that. He showed me love as a person, and didn't put pressure on. That opened my eyes to some of the things about recruiting, and about what's important. I wanted to be around people like that, so I committed to West Virginia."
It says a lot that Irvin would consider West Virginia's tradition on par with Tennessee's, but it's clear that the relationship he forged with Galloway was a major factor in his jump to WVU. Irvin spoke glowingly of Galloway and his talks, even while he was in the Volunteer fold.
After tearing up the field in California, he's now set to come east to do the same in Division I. He had 72 tackles, including 18 sacks and 21 tackles for losses in 2009. He forced three fumbles and recovered another, returning it 96 yards for a score, and also had ten quarterback hurries. Those numbers foreshadow his use as a pass rusher at West Virginia, and he has already discussed some scenarios in the way he will be used defensively.
"I think I will get up to around 240 or 245 pounds, but I want to keep my speed," said Irvin, who claims a 4.4 time in the 40-yard dash. "I have talked to Jeff Casteel and Bill Kirelawich, and they told me they might use me like a DeMarcus Ware. The may move me around so the offense won't know whether I'm blitzing or dropping back. They could line me up as a linebacker, or if they want to go with an extra man up front, I can drop down to defensive end without the defense having to change personnel."
Irvin has some experience in that sort of role, having moved around at times at Mt. San Antonio in order to keep opponents from keying on him. He believes he can have similar success at West Virginia, where the defensive scheme could be built around edge rushers with the ability to play both down and off the line of scrimmage.
"I just feel like at 6-4 and running a legit 4.4, there aren't many players that can do what I can do," he said with conviction. "I have three years to play two, but I am going to play this year. I am confident in what I can do, and that's the way I am going to approach it."
Share on Facebook Share on TwitterTrending on Scout3-Star Pass-Rusher Talks Houston PledgeEmerging O-Lineman Talks Early OffersFour-Star DB Discusses WVU Visit, New OfferFirst Offer Arrives for East Texas SleeperUS & Japan Counter China in South China SeaScout 300 WR Eyes Upcoming Power 5 Visits Full StoryMountaineers Daily Top StoriesBreaking NewsElijah Macon Going ProElijah Macon will skip his senior year and head off to play ball professionally.by Chris AndersonMountaineers DailyYesterday at 12:05 PMFour-Star DB Discusses WVU Visit, New OfferFour-star defensive back receives a new WVU offer and hears about the Mountaineers from an unlikely source.by Chris AndersonMountaineers DailyYesterday at 4:01 AMVisit Could Lead to Good News for WVUWVU leads for this Georgia defensive back.by Chris AndersonMountaineers DailyMonday at 4:35 AMCramer Homers Twice in Regular-Season FinaleWVU falls to Texas in the regular season finale, 9-4.by Media RElationsMountaineers DailySunday at 4:00 PMIvy Explains WVU's Spot in Top FourT.J. Ivy discusses the plan West Virginia has for him at tight end.by Chris AndersonMountaineers DailySunday at 4:20 AMMountaineers Grind Out Series-Evening WinWVU baseball edges Texas, 4-3, to even the series in Austin.by Media RElationsMountaineers DailySaturday at 5:15 PMNew Georgia Offer: "I Could See Myself" at WVPeach County linebacker JaQuez Jackson discusses his new West Virginia offer and visit plans for the summer.by Chris AndersonMountaineers DailySaturday at 4:54 AMWR, OL highlight WVU's needs in 2018West Virginia's coaching staff is working hard to put together a strong 2018 recruiting class and Scout takes a look at some of the top offensive targets.by Michael ClarkScout FootballYesterday at 8:51 AMScout 300 WR Eyes Upcoming Power 5 VisitsMONTVALE, N.J. -- Scout 300 receiver Shaquon Anderson-Butts breaks down schools he is planning to visit.by Brian DohnScout FootballYesterday at 5:57 AMMiller Serves up Top Three SchoolsSEFFNER, Fla. -- James Miller, who checks in as the nation's 14th-ranked inside linebacker, has a decision timeline and No. 1 school in his recruitment.by Corey BenderScout FootballFriday at 9:19 AMNew Specialist Offer Sees Opportunity at WVUHunter Pearson received his second offer, this one from West Virginia. He discusses the Mountaineers.by Chris AndersonMountaineers DailyFriday at 4:34 AMMidwest Tight End Names Top SchoolsChicago (IL) Marist tight end TJ Ivy puts West Virginia in his list of top schools.by Chris AndersonMountaineers DailyThursday at 6:50 AMLoad More

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Heroes: The Complete Seri... has been added to your Cart
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I think the story lines are brilliant, each character has their own powers and their own struggles in life. A great combo of comedy horror and drama, a must see.
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I ordered this product new. When it arrived it is anything but knew many scratches on many of the desks and was dirty on others. Patent false advertising.
5.0 out of 5 stars(And this is a great show.
I'm on the second disk; and so far, no problems! (And this is a great show...)
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Cold Cold Heart by Tami Hoag, Hardcover | Barnes & Noble® B&N Top 100 NY Times Bestsellers
“It might. Or it might not. She could drift in and out like this for a long time, or she may become fully conscious tomorrow. She has been saying words these last few days. She’s been responsive to vocal commands. These are positive signs, but every brain is different. “The kinds of injuries Dana sustained can mean she may have difficulty organizing her thoughts or performing routine tasks. She may become impulsive, have trouble controlling her emotions or empathizing with other people. She may have difficulty speaking, or she may speak perfectly but not always be able to grab the right words from her brain.
"Chilling and satisfying." -- People
“A top-notch psychological thriller.” -- Kirkus Reviews
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"Ms. Hoag weaves the intensifying plot in "Cold Cold Heart" with the expertise of a master seamstress blind stitching the facts, moving through multiple characters' voices, taking readers on a journey into the inner depths of her characters' minds, and in Hoag style, delivering a walloping ending." --Pittsburgh Post-Gazette
Cold Cold Heart 4 out of 5 based on 0 ratings. 50 reviews.
Great story , kept me on the edge of my seat! Tami never disappoints
Suspenseful till the end.
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Although Cortez was too young to remember the extravagant life style his father tried to ...
Although Cortez was too young to remember the extravagant life style his father tried to provide for themHe clearly remembers the last hour that he spent with his father covered in blood giving him principles to live byWith tragedies after ...

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Watchmen: The Deluxe Edition by Alan Moore, Dave Gibbons |, Hardcover | Barnes & Noble®
A New York Times Bestseller!In an alternate world where the mere presence of American superheroes changed history, the US won the Vietnam War, Nixon is still president, and the cold war is in full effect. WATCHMEN begins as a murder-mystery, but soon unfolds into a planet-altering conspiracy. As the resolution comes to a head, the unlikely group of
Watchmen: The Deluxe Edition available in
A New York Times Bestseller!In an alternate world where the mere presence of American superheroes changed history, the US won the Vietnam War, Nixon is still president, and the cold war is in full effect. WATCHMEN begins as a murder-mystery, but soon unfolds into a planet-altering conspiracy. As the resolution comes to a head, the unlikely group of reunited heroes--Rorschach, Nite Owl, Silk Spectre, Dr. Manhattan and Ozymandias--have to test the limits of their convictions and ask themselves where the true line is between good and evil. In the mid-eighties, Alan Moore and Dave Gibbons created WATCHMEN, changing the course of comics' history and essentially remaking how popular culture perceived the genre. Popularly cited as the point where comics came of age, WATCHMEN's sophisticated take on superheroes has been universally acclaimed for its psychological depth and realism.WATCHMEN is collected here in deluxe hardcover, with sketches, extra bonus material and a new introduction by series artist Dave Gibbons.
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7.60(w) x 10.96(h) x 1.08(d)
Watchmen: The Deluxe Edition 5 out of 5 based on 0 ratings.
Not only is this a great graphic novel, it is a great work of fiction, that deals with an ethical dillema philosophers and scholars have been puzzling over for years. I would honestly reccomend it to anyone, even if you dont really enjoy graphic novels.
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Classic Alan Moore
A great work of fiction with an amazing printing quality.
Watchmen completely blew me away!!! It has become not only my favorite graphic novel, but also one of my favorite books, regardless of genre. It avoids cliches, like having heroes who are largely devoid of baggage. All the main characters carry his/her respective personal demons and flaws, which in turn affect not only how they interact with each other, but also how they view the world. Watchmen is a magnum opus of both storytelling and imagery. The world herein is one that is in may ways at the precipice. The collective sense of foreboding is maintained and reinforced throughout by the dark, brooding, imposing atmospheres. The end result is a work that is enduring, gritty, and thought provoking. Strongly recommended for fiction lovers and a must have for graphic novel fans. Anonymous
A classic. Can't be beat. If you haven't read this 5 times, you're not a comic fan.


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Terebellida - Wikipedia, the free encyclopedia
Terebellida make up an order of the Polychaeta class, commonly referred to as "bristle worms". Together with the Sabellida, the Spionida and some enigmatic families of unclear taxonomic relationship (e.g. the Saccocirridae), they make up the subclass Canalipalpata, one of the three main clades of polychaetes.[1] Like most polychaetes, almost all members of the Terebellida are marine organisms. Most are small, sessile detritivores (deposit feeders) which live in small tubes they build from mud or similar substrate, or burrow in the sand. Their central nervous system displays characteristic apomorphies.
Living tube of Lanice conchilega (Terebellidae) in the Wadden Sea at low tide.
Such structures can be preserved as fossils.
There is little consensus on the number of families. Some treatments accept as little as five,[2][3] while other authors list over a dozen. Here, the more inclusive view of the Terebellida is followed, based on a major review of polychaete systematics.[1] Cladistic studies have hitherto only analyzed a rather small proportion of polychaetes; hence it may be that some of the families today included in Terebellida by most authors will eventually be again recognized to belong elsewhere.
Acrocirridae (acrocirrids, sometimes placed in Spionida suborder)
Alvinellidae (alvinellids)
Ampharetidae (ampharetids)
Ampharetinae (ampharetines, a subfamily)
Cirratulidae (cirratulids, sometimes placed in Spionida suborder)
Ctenodrilidae (ctenodrilids, sometimes own suborder Ctenodrilida)
Fauveliopsidae (fauveliopsids, sometimes own suborder Fauveliopsida)
Flabelligeridae (flabelligerids, sometimes Flabelligerida suborder)
Flotidae (flotids, sometimes included in Flabelligeridae)
Pectinariidae (pectinariids, commonly referred to as trumpet worms or ice cream cone worms)
Poeobiidae (poeobiids, sometimes own suborder Poeobiida or included in Flabelligerida suborder)
Sternaspidae (sternaspids, sometimes own suborder Sternaspida)
Terebellidae (terebellids, commonly referred to as spaghetti worms)
Trichobranchidae (trichobranchids)
Alvinella pompejana, an Alvinellidae
Cirratulus cirratus, a Cirratulidae
Diplocirrus incognitus, a Flabelligeridae
Lagis koreni, a Pectinariidae (with its tube)
Lanice conchilega, a Terebellidae
A notable terebellid is the Pompeii worm (Alvinella pompejana), an alvinellid. It is the most heat-tolerant complex organism known on Earth. Found near hydrothermal vents deep in the Pacific Ocean, it thrives at a temperature of 50 °C (122 °F). This is near the theoretical limit for eukaryotes, whose mitochondria disintegrate at about 55 °C (131 °F).
Seven species of pelagic (free-swimming) terebellids have recently been discovered, including Swima in 2009[4][5][6] and Teuthidodrilus in 2010.[7][8][9][10][11] These seven species have been assigned to four new genera, forming a phylogenetic clade within the Acrocirridae family.[4][12]
Polychaetes lack a firm skeleton, so they do not fossilize well. For this reason, only a small number of prehistoric bristle worms have been described. Several of these have been placed in the Terebellida suborder, though often only tentatively so, owing to the ongoing uncertainties about polychaete phylogeny. However, as the terebellid habit of constructing characteristic tubes in which to live seems quite ancient, such structures are occasionally found in conservation Lagerstätten. Polychaete remains associated with such ichnofossils can therefore be quite certainly be allocated to the Terebellida.[citation needed] Prehistoric polychaete genera historically presumed to be Terebellida include the following, though most are now recognized as trace fossils of uncertain makers:
Cryptosiphon Prantl, 1948
Granularia Pomel, 1849
Harlania Goppert, 1852
Lepidenteron Fritsch, 1878
Paraterebella Howell, 1955 (= Terebellopsis Howell, 1953)
Proterebella Howell, 1953
Psammosiphon Vine, 1882
Scalarituba Weller, 1899
Scolecoderma Salter, 1855
Terebellites Howell, 1943
Terebelloides Desio, 1940
Terebellolites Desio, 1940
Terebellopsis Leymerie, 1844 (see also Paraterebella)
Eupolymnia crasscornis
Pectinaria australis
^ a b Rouse GW, Fauchald K (1998). "Recent views on the status, delineation, and classification of the Annelida" (PDF). American Zoologist 38 (6): 953–64. doi:10.1093/icb/38.6.953. Retrieved 2010-11-25. ^ Fauchald K (1977). "The polychaete worms, definitions and keys to the orders, families and genera". Natural History Museum of Los Angeles County Science Series 28: 1–188. ^ Holthe T (2001). "The Polychaeta Terebellida homepage". Retrieved 2010-11-25. ^ a b Osborn KJ, Haddock SH, Pleijel F, Madin LP, Rouse GW (2009). "Deep-sea, swimming worms with luminescent "bombs" (subscription only)". Science 325 (5943): 964. doi:10.1126/science.1172488. ^ Moskowitz C (2009). "Sea creature releases glowing decoy 'bombs'". LiveScience. Retrieved 2010-11-25. ^ International Institute for Species Exploration (2010). "Bombardier Worm". Top 10 New Species - 2010. Tempe, Arizona: Arizona State University. ^ "Spindly species found in ocean's crushing depths". Yahoo! News. Agence France-Presse. 2010-11-24. Retrieved 2010-11-25. ^ Cressey D (November 24, 2010). "The Great Beyond: Strange ‘squidworm’ showcases sea’s secrets". Nature.com Blogs. Retrieved 2010-11-25. ^ Sample I (November 23, 2010). "'Squid worm' emerges from the deep". The Guardian. Retrieved 2010-11-25. ^ Watson T (2010). ""Flamboyant" New Squid Worm Surprises, Delights Experts". National Geographic Daily News. National Geographic Society. Retrieved 2010-11-25. ^ Osborn KJ, Madin LP, Rouse GW (2010). "The remarkable squidworm is an example of discoveries that await in deep-pelagic habitats". Biology Letters 7 (3): in press. doi:10.1098/rsbl.2010.0923. PMC 3097850. PMID 21106571. Retrieved 2010-11-25. ^ Osborn KJ, Rouse GW (2010). "Phylogenetics of Acrocirridae and Flabelligeridae (subscription only)". Zoologica Scripta: in press. doi:10.1111/j.1463-6409.2010.00460.x. External links[edit]
Wikispecies has information related to: Terebellida
Wikimedia Commons has media related to Terebellida.
Retrieved from "https://en.wikipedia.org/w/index.php?title=Terebellida&oldid=727112887"	Categories: TerebellidaHidden categories: Articles with 'species' microformatsAll articles with unsourced statementsArticles with unsourced statements from November 2010Commons category with page title same as on Wikidata	Navigation menu
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