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Horydczak Collection - Theodor Horydczak - Biographical Information - Prints & Photographs Online Catalog (Library of Congress) skip navigation
Theodor Horydczak - Biographical Information Cataloging the Collection
Little is known about Theodor Horydczak himself. According to the 1930 Census, he was born in Poland in 1889, and the Social Security Death Index lists his death in Montgomery, Pennsylvania, in 1971. With his wife Frederica he had one daughter Norma. He is believed to have taken up photography during or after World War I, possibly while a member of the U.S. Army Signal Corps.
Horydczak's residence in Washington, D.C., spanned the period from the early 1920s to his retirement in 1959. Horydczak's studio logbook opens with a 1921 entry for a photograph of cherry blossoms along the Tidal Basin.
Theodor Horydczak lying on ground with camera I, 1930s?.
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Patent US8169793 - Electronic device and fabrication method thereof - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign in<nobr>Advanced Patent Search</nobr>PatentsProvided is an electronic device of high reliability having an exposed functional portion. An electronic device 10 comprises an electronic element 11 having an exposed functional portion 11 a on a first surface, a frame member 12 having a first penetration hole 12 a, and a board 13 having a second penetration...http://www.google.com/patents/US8169793?utm_source=gb-gplus-sharePatent US8169793 - Electronic device and fabrication method thereofAdvanced Patent SearchPublication numberUS8169793 B2Publication typeGrantApplication numberUS 12/911,574Publication dateMay 1, 2012Filing dateOct 25, 2010Priority dateOct 26, 2009Also published asCN102054794A, US20110096515, US20120180311Publication number12911574, 911574, US 8169793 B2, US 8169793B2, US-B2-8169793, US8169793 B2, US8169793B2InventorsKenji UchidaOriginal AssigneeRenesas Electronics CorporationExport CitationBiBTeX, EndNote, RefManPatent Citations (4), Classifications (15), Legal Events (1) External Links: USPTO, USPTO Assignment, EspacenetElectronic device and fabrication method thereofUS 8169793 B2Abstract Provided is an electronic device of high reliability having an exposed functional portion. An electronic device 10 comprises an electronic element 11 having an exposed functional portion 11 a on a first surface, a frame member 12 having a first penetration hole 12 a, and a board 13 having a second penetration hole 13 a. The frame member 12 is provided on the first surface of the electronic element 11 such that the first penetration hole 12 a faces at least a part of the functional portion 11 a. The electronic element 11 is mounted on the board 13 such that at least a part of the functional portion 11 a faces the second penetration hole 13 a. The frame member 12 does not contact with the board 13. Images(10) Claims(4)
an electronic element having an exposed functional portion on a first surface,
a frame member having a first penetration hole, and
a board having a second penetration hole, wherein;
the frame member is provided on the first surface of the electronic element such that the first penetration hole faces at least a part of the functional portion,
the electronic element is mounted on the board such that at least a part of the functional portion faces the second penetration hole, and
the frame member does not contact with the board,
wherein a gap is formed between an outer surface of the frame member and an internal surface of the second penetration hole of the board.
2. The electronic device according to claim 1, wherein the frame member is inserted into the second penetration hole of the board.
3. The electronic device according to claim 1, wherein the frame member has a height of 0.03 mm or more.
4. The electronic device according to claim 1, wherein the frame member is made of resin. Description
REFERENCE TO RELATED APPLICATION This application is based upon and claims the benefit of the priority of Japanese patent application No. 2009-245655, filed on Oct. 26, 2009, the disclosure of which is incorporated herein in its entirety by reference thereto.
TECHNICAL FIELD This invention relates to an electronic device having an exposed functional portion and a fabrication method thereof.
BACKGROUND An electronic device for converting an optical signal from outside into an electric signal, for example, is provided with an electronic element having a light receiving portion as a functional portion. In a case where resin is present on an optical path of the optical signal in such an electronic device, the optical signal is attenuated. Besides that a black resin, which can adapt an electronic device to a lead-free reflow conditions by improving a humidity resistance of the electronic device, cannot be used on an optical path of an optical signal. In addition, as for an electronic device relating to an optical recording technology using a blue light for the optical signal, when an epoxy resin is used on an optical path, the epoxy resin on the optical path is degraded by the blue light and light transmittance of the epoxy resin is decreased. Thus some of such electronic devices are structured such that no resin is provided on an optical path, that is, a light receiving portion is exposed (Patent Document 1, for example). It is expected that an electronic device having an exposed functional portion can be applied to MEMS (Micro Electro-Mechanical Systems), a device in which a moving part of a functional element (electro-acoustic filter, for example) cannot be coated with resin, solid image sensing element for a camera, and the like.
Patent Document 1 discloses a semiconductor device having a protruding portion for preventing contamination of an exposed light receiving element. As to the semiconductor device disclosed in Patent Document 1, a semiconductor bare chip having a light receiving portion is mounted on a circuit board by flip chip attachment, a penetration hole is provided on the circuit board at a position corresponding to the light receiving element, and sealing resin is applied between the semiconductor bare chip and the circuit board. The frame-shaped protruding portion is provided around the penetration hole on the circuit board and the semiconductor bare chip is mounted in contact with the top of the protruding portion.
[Patent Document 1] Japanese Patent Kokai Publication No. JP-P2003-68939A SUMMARY The entire disclosure of Patent Document 1 is incorporated herein by reference thereto. The following analyses are given by the present invention.
According to the semiconductor device of Patent Document 1, the protruding portion is provided between the electronic element and the circuit board, and at the same time, in contact with the electronic element. Thus there may be a risk that the protruding portion exerts local pressure and causes a breakage of the electronic element. Particularly, the pressure exerted to the electronic element may increase when the electronic element is mounted on a board or when the protruding portion expanded during a heat processing.
For preventing the breakage of the electronic element due to the local pressure (or load) by the protruding portion at the flip chip attachment, a pressure control will become necessary. However, when controlling of the local pressure is necessary, it is difficult to mount electronic elements rapidly and therefore, productivity will become worse.
In addition, the semiconductor device according to Patent Document 1 requires high dimensional precision of heights of the protruding portion and the bump. If the dimensional precision is low for these elements, an electric contact between the electronic element and the board cannot be secured or the electronic element may be damaged due to local pressure by the protruding portion. On the other hand, for improving the dimensional precision of the elements, additional equipments for improving the high precision become necessary and it causes decrease of the productivity and increase of the production cost. Thus there is much desired in the art.
According to a first aspect of the present invention, there is provided an electronic device comprising: an electronic element having an exposed functional portion on a first surface; a frame member having a first penetration hole; and a board having a second penetration hole. The frame member is provided on the first surface of the electronic element such that the first penetration hole faces at least a part of the functional portion. The electronic element is mounted on the board such that at least a part of the functional portion faces the second penetration hole. The frame member does not contact with the board.
According to a second aspect of the present invention, there is provided a method for fabricating an electronic device comprising: making a frame member on a first surface of an electronic element having an exposed functional portion on the first surface such that the frame member surrounds at least a part of the functional portion; and mounting the electronic element on a board having a penetration hole such that the penetration hole faces at least a part of the functional portion.
The present invention has at least one effect described below.
According to the present invention, the frame member does not contact with the board. Thus a local pressure exerted to the electronic element by the frame member can be avoided. As a result, the present invention provides a high functional and high reliable electronic device.
According to the present invention, there is no need to fabricate the frame and an electrically conductive member (bump) between the electronic element and the board with high precision. Therefore, it is possible to fabricate such electronic devices without decreasing productivity and increasing production cost.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic device according to a first exemplary embodiment of the present invention.
FIG. 2 is a cross sectional view along II-II line in FIG. 1.
FIGS. 3A to 3F are process flow diagrams for illustrating fabrication manner of an electronic device according to a first exemplary embodiment of the present invention.
FIGS. 4A to 4D are process flow diagrams for illustrating fabrication manner of an electronic device according to a first exemplary embodiment of the present invention.
FIG. 5 is a cross sectional view of an electronic device according to a second exemplary embodiment of the present invention.
FIG. 6 is a process flow diagram for illustrating fabrication manner of an electronic device according to a second exemplary embodiment of the present invention.
FIG. 7 is a cross sectional view of an electronic device according to a third exemplary embodiment of the present invention.
FIG. 8 is a cross sectional view of an electronic device according to a fourth exemplary embodiment of the present invention.
FIG. 9 is a process flow diagram for illustrating fabrication manner of an electronic device according to a fourth exemplary embodiment of the present invention.
PREFERRED MODES Followings are preferred modes of each aspect of the present invention.
According to a preferred mode of a first aspect of the present invention, the frame member is inserted into the second penetration hole of the board.
According to a preferred mode of a first aspect of the present invention, a gap is formed between an outer surface of the frame member and an internal surface of the second penetration hole of the board.
According to a preferred mode of a first aspect of the present invention, the frame member has a height of 0.03 mm or more.
According to a preferred mode of a first aspect of the present invention, the frame member is made of resin.
According to a preferred mode of a second aspect of the present invention, the electronic element is mounted on the board such that the frame member is inserted into the penetration hole in a mounting step.
According to a preferred mode of a second aspect of the present invention, the step for making a frame member comprises: forming a precursor film for a frame member on the electronic element, and processing the precursor film for a frame member such that at least a part of the functional portion is exposed.
An electronic device according to a first exemplary embodiment of the present invention will be explained. FIG. 1 is a perspective view of an electronic device according to a first exemplary embodiment of the present invention. FIG. 2 is a cross sectional view along II-II line in FIG. 1.
The electronic device 10 comprises a board 13, and an electronic element 11 mounted on the board 13 by a flip chip attachment. The electronic element 11 is connected with the board by an electrically conductive member (bump) 14. For example, an electric signal in the electronic element 11 is conveyed to the board 13 through the electrically conductive member 14 and then transferred to a terminal formed on the opposite surface to a surface facing to the electronic element 11 via an internal wiring of the board 13. The electrically conductive member 14 is coated with an underfill resin 15 and the underfill resin 15 acts so as to unite the board 13 and the electronic element 11.
The electronic element 11 comprises a functional portion 11 a. The electronic element 11 may be, for example, a light receiving element for converting an optical signal into an electrical signal. In this case, the functional portion 11 a is a light receiving portion.
The electronic device 10 further comprises a frame member or a pipe member 12 (referred to as �frame member� hereinafter) in which a first penetration hole 12 a is perforated. The frame member 12 is provided on the electronic element 11 such that the first penetration hole 12 a of the frame member 12 faces at least a part of the functional portion 11 a and at least a part of the functional portion 11 a is exposed through the first penetration hole 12 a. Preferably, the frame member 12 is formed so as to surround the whole of the exposed part of the functional portion 11 a. The board 13 has a second penetration hole 13 a at a position corresponding to the functional portion 11 a of the electronic element 11. This means that the second penetration hole 13 a faces at least a part of the functional portion 11 a. The first penetration hole 12 a of the frame member 12 and the second penetration hole 13 a of the board 13 are also facing (opposing) each other. The board 13 does not contact with the frame member 12. Preferably, the electronic element 11 is mounted such that the frame member 12 is inserted in the second penetration hole 13 a of the board 13. In this case a space d is formed between an outer surface of the frame member 12 and an internal surface of the second penetration hole 13 a of the board 13. A distance of the space d is preferably formed such that the frame member 12 will not contact with the board 13 even when the frame member 12 and the board 13 expanded or elongated due to increasing of temperature. It is possible to prevent, owing to the arrangement, the board 13 from pressing the electronic element 11 locally via the frame member 12 even when the electronic element 11 is mounted on the board 13 or when the frame member 12 expanded by a heating step (heating step for mounting or a durability test such as a heating cycle test, etc. of an electronic device 10), for example. As a result, according to the present invention, it becomes possible to prevent breakage of the electronic element 11 by the frame member 12. Furthermore, upon temperature fluctuation, the frame member 12 can expand and contract independently from other elements having different linear expansion coefficients. As a result, according to the present invention, it becomes possible to prevent the frame member 12 from detaching from the electronic element 11 or exerting pressing force on the electronic element 11 even when the temperature fluctuated. In addition, a stress exerted on the electrically conductive member 14 can be reduced when the temperature fluctuated because expansion and contraction of the board 13 are not influenced by the frame member 12, or rather a freedom of degree of expansion and contraction can be improved by the space d. As a result, according to the present invention, it becomes possible to improve reliability of an electrical connection.
At least a part, preferably the whole, of the functional portion 11 a of the electronic element 11 is exposed through the first penetration hole 12 a of the frame member 12 and the second penetration hole 13 a of the board 13. When the functional portion 11 a is a light receiving portion, for example, an optical signal is input to the light receiving portion 11 a through the first penetration hole 12 a of the frame member 12.
Preferably, the height of the frame member 12 (height from a surface of the electronic element 11) is set such that the underfill resin 15 does not get over the frame member 12 into the first penetration hole 12 a when the underfill resin 15 is filled. Preferably, a height of the frame member 12 is 0.03 mm or more (0.1 mm, for example) when the underfill resin 15 is an epoxy resin, for example. It may be possible to prevent the underfill resin 15 from getting over the frame member 12 onto the surface of the functional portion 11 a unless oversupplying the underfill resin 15. Preferably, the height of the frame member 12 is set such that the frame member 12 does not project from the surface of the board 13 too much. For example, a height of the frame member 12 is preferably 1 mm or less. If the frame member 12 projects from the board 13 too high, the electronic device 10 becomes so thick.
A planar shape (outer circumferential shape) of an end surface of the frame member 12 is depicted as an annular shape (a planer shape of the first penetration hole 12 a is circle) in FIG. 1; however, the shape is not limited to the shape but various shapes can be applied. For example, a planar shape of the end surface of the frame member 12 may be oval or polygonal. Also a shape of the first penetration hole 12 a (inner circumferential shape) cannot be limited to a circle but can be various shapes such as an oval or polygon.
The frame member 12 may be formed by a resin, for example. When using a resin as a material of the frame member 12, the material of the frame member 12 may include photo-setting resin such as an acrylic resin or thermo-setting resin such as an epoxy resin. A kinetic viscoelasticity of the frame member 12 ranges preferably from 2 GPa to 6 GPa at 25 degrees C. in hardened state. In addition, the kinetic viscoelasticity of the frame member 12 ranges preferably at least 1 MPa, and 50 MPa or less at 200 degrees C. in hardened state. By virtue of the viscoelasticity of the frame member 12 of these ranges, the frame member 12 can deform elastically to some extent in accordance with the fluctuations of temperature and relieve the thermal stress during a reflow step for mounting the electronic device 10 or an environmental test, and the like. The viscoelasticity of the frame member 12 is measured in conformity with JISK7244-4.
The electronic device 10 further comprises a sealing resin 16. The sealing resin 16 seals a side of the board 13 on which the electronic element 11 is mounted so as to cover and protect the electronic element 11. An epoxy resin, for example, may be used as the sealing resin 16.
The electronic device 10 may further comprise a protection film (not shown) for protecting the functional portion 11 a on the frame member 12 and the board 13. Preferably the protecting film shows a heat-resistance property at a temperature of reflow step or more and is made of a material that can be detached.
Next, a fabrication method of the electronic device according to a first exemplary embodiment of the present invention will be explained. A semiconductor device mounting a semiconductor element having a light receiving portion as a functional portion is employed as an example. FIGS. 3 and 4 are process flow diagrams illustrating fabrication steps of an electronic device according to a first exemplary embodiment of the present invention.
At first a wafer 11A, on which a plurality of semiconductor elements are formed as electronic elements, is prepared as shown in FIG. 3A. A light receiving portion 11 a is exposed on a surface of each semiconductor element of the wafer 11A. Although two semiconductor elements are shown in FIG. 3A, the number of the semiconductor elements is not limited to two but may be one or 3 or more.
Next, a precursor film 12A for frame member is formed on the wafer 11A as shown in FIG. 3B. In a case where the frame member 12 is formed by a resin, a resin film or liquid resin may be used for the precursor film 12A for frame member. A resin film having a uniform thickness is more preferable. It will be easier to form a film made of resin having a thickness of uniform 0.03 mm or more on the whole wafer 11A by using a resin film than a liquid resin. When forming a frame member of a height of 0.1 mm, a precursor film 12A for frame member having a thickness of 0.1 mm will be used.
Next, the precursor film 12A for frame member is exposed and patterned using a mask 18 as shown in FIG. 3C. At this step the precursor film 12A for frame member is patterned such that the first penetration hole 12 a of frame member 12 exposes at least a part, preferably the whole, of the light receiving portion 11 a. Next, the precursor film 12A for frame member is developed and other parts (exposed parts) than a part that is to be a frame member 12 are removed. Then the precursor film 12A for frame member is formed into a shape of the frame member 12 to surround each of the light receiving portions 11 a. Next, the precursor film 12A for frame member is heated to harden to form the frame member 12 (FIG. 3D) (the step shown by FIGS. 3B to 3D is referred to as frame member forming step). The heat processing produces secured union of the frame member 12 and the semiconductor element (wafer 11A). The frame member 12 won't be deformed so much by the heat processing.
According to the fabrication method, a plurality of frame members 12 of a plurality semiconductor elements 11 can be formed at one time and production efficiency can be increased.
Next, an electrically conductive member 14, for attaching the wafer to the board 13 by flip chip, is formed on the wafer 11A (FIG. 3E). According to the present invention, the bump can be formed without taking the frame member 12 into account, that is, without requiring a high precision of height.
Next, the wafer 11A is cut into individual semiconductor element to form the semiconductor element 11 having a frame member 12 (FIG. 3F).
Next, a precursor material 13A for board containing a plurality of board 13 is prepared. A second penetration hole 13 a is formed on each of the boards 13 of the precursor material 13A for board. Next, the semiconductor elements 11 are attached by flip chip on the precursor material 13A for board (FIG. 4A, referred to as mounting step). At this step, the semiconductor element 11 is attached such that the second penetration hole 13 a of the board 13 faces both of the light receiving portion 11 a and the first penetration hole 12 a of the frame member 12 and such that the frame member 12 is inserted into the second penetration hole 13 a. According to the present invention, because the frame member 12 does not contact with the board 13, unnecessary stress toward the semiconductor element 11 from the frame member 12 in the mounting step can be prevented. A mounting efficiency is not decreased because a load control against the pressure from the frame 12 can be eliminated.
Next, an underfill resin 15 is formed around the electrically conductive member 14 for reinforcing the connection between the precursor material 13A for board and the semiconductor element 11 (FIG. 4B). When filling the underfill resin 15, spreading of the underfill resin 15 onto the light receiving portion 11 a can be prevented by the frame member 12.
Next, a plurality of semiconductor elements 11 are sealed as a whole by a sealing resin 16 (FIG. 4C). The light receiving portion 11 a is not covered by the sealing resin 16 because the underfill resin 15 is filled between the precursor material 13A for board and the semiconductor element 11 and the light receiving portion 11 a is surrounded by the frame member 12.
Next, the precursor material 13A for board and the sealing resin are separated according to each semiconductor element 11 to produce the electronic device (semiconductor device) 10.
A protection film (not shown) for covering the frame member 12 and the board 13 may be formed as necessary.
Next, an electronic device according to a second exemplary embodiment of the present invention will be explained. FIG. 5 is a cross sectional view of an electronic device according to a second exemplary embodiment of the present invention. In FIG. 5, the same element as a first exemplary embodiment is denoted by the same symbol.
A sealing resin 26 seals the whole of the electronic element 11 in the electronic device 10 of a first exemplary embodiment; however, a sealing resin 26 of an electronic device 20 of a second exemplary embodiment is formed such that a surface (referred to as �second surface� hereinafter) opposite to a surface (referred to as �first surface� hereinafter) on which the functional portion 11 a of the electronic element 11 is formed is exposed. Other structures of the electronic device 20 of a second exemplary embodiment are the same as those of a first exemplary embodiment.
Next, a fabrication method of the electronic device 20 of a second exemplary embodiment will be explained. FIG. 6 is a process flow diagram illustrating fabrication steps of the electronic device 20 of a second exemplary embodiment. A different step from the fabrication method of the electronic device 10 of a first exemplary embodiment, shown in FIGS. 3 and 4, is the resin sealing step shown in FIG. 4C. After the underfill resin forming step shown in FIG. 4B, a buffer sheet 21 is provided on the second surface of the electronic element 11 as shown in FIG. 6. Then a first sealing die 22 a and a second sealing die 22 b are set from upside and downside, respectively, and a sealing resin 26 is provided. The sealing resin 26 can be formed without covering the second surface of the electronic element 11 by such a fabrication method. The buffer sheet 21 is provided between the electronic element 11 and the sealing die 22 and prevents the sealing resin 26 from flowing into the second surface of the electronic element 11 and prevents the sealing die 22 from damaging the electronic element 11. A resin sheet having an extensibility and flexibility can be used as a buffer sheet 21 and a release film, for example, can be available.
Other fabrication steps of the electronic device 20 of a second exemplary embodiment are the same as those of a first exemplary embodiment.
According to a second exemplary embodiment, a heat radiation efficiency of the electronic element can be improved and therefore, a malfunction of the electronic device can be prevented.
Next, an electronic device according to a third exemplary embodiment of the present invention will be explained. FIG. 7 is a cross sectional view of an electronic device of a third exemplary embodiment of the present invention. In FIG. 7, the same element as a first exemplary embodiment is denoted by the same symbol.
An electronic device 30 of a third exemplary embodiment, which is different from a first exemplary embodiment or a second exemplary embodiment, has no sealing resin. Other structures of the electronic device of a third exemplary embodiment are the same as those of a first exemplary embodiment.
A fabrication method of the electronic device 30 of a third exemplary embodiment is the same as that of a first exemplary embodiment except that the resin sealing step shown in FIG. 4C is eliminated.
According to a third exemplary embodiment, a heat radiation efficiency of the electronic device can be improved and therefore, a malfunction of the electronic device can be prevented.
Next, an electronic device according to a fourth exemplary embodiment of the present invention will be explained. FIG. 8 is a cross sectional view of an electronic device of a fourth exemplary embodiment of the present invention. In FIG. 8, the same element as a first exemplary embodiment is denoted by the same symbol.
An electronic device 40 of a fourth exemplary embodiment, which is different from first to third exemplary embodiments, has no underfill resin. However, instead of that, a sealing resin 46 is filled between the electronic element 11 and the board 13, between the frame member 12 and the board 13 and around the electronic element 11.
Preferably, a top surface (end surface at a side of board 13) 12 b of the frame member 12 protrudes from a top surface (exposed surface) 13 b of the board 13. Preferably, the top surface 12 b of the frame member 12 protrudes from the top surface 13 b of the board 13 by 0.05 mm or more, for example. It is possible to prevent the sealing resin 46 from flowing into the first penetration hole 12 a of the frame 12 during the resin sealing step by the protrusion of the top surface 12 b of the frame member 12 from the top surface 13 b of the board 13.
Other structures of the electronic element 40 of a fourth exemplary embodiment are the same as those of a first exemplary embodiment.
According to a fourth exemplary embodiment, the sealing resin 46 provided between the frame member 12 and the board 13 can relieve the stress due to an expansion or contraction of the elements caused by the fluctuations of temperature. As a result a reliability of the electronic device 40 can be improved.
Next, a fabrication method of the electronic device 40 of a fourth exemplary embodiment will be explained. The fabrication method of the electronic device 40 of a fourth exemplary embodiment does not include an underfill resin forming step shown in FIG. 4B. Instead of that, the sealing resin 46 is filled also between the electronic element 11 and the board 13 in the resin sealing step. FIG. 9 is a schematic sectional view for illustrating fabrication steps of the electronic device 40 of a fourth exemplary embodiment. As shown in FIG. 9, a first buffer sheet 41 a is provided on the second surface of the electronic element 11 and a second buffer sheet 41 b is provided on the upper surface (exposed surface) 13 b of the board 13 after the mounting step shown in FIG. 4A. The first and the second buffer sheets 41 a and 41 b are similar to the buffer sheet of a second exemplary embodiment. Then a first and a second sealing dies 42 a and 42 b are set on the first and the second buffer sheets 41 a and 41 b at upper and lower layers, respectively, and the sealing resin 46 is formed. It is preferable to provide the second buffer sheet 41 b such that the top surface 12 b of the frame member 12 sinks into the second buffer sheet 41 b or the second buffer sheet 41 b is depressed by the top surface 12 b of the frame member 12. The structure can prevent the sealing resin 46 from flowing into the first penetration hole 12 a of the frame member 12. The flowing of the sealing resin 46 into the first penetration hole 12 a can be also prevented by forming the frame members 12 in a uniform height. A local pressure exerted on the electronic element 11 by the die-forming may be diminished by an elastic deformation of the second buffer sheet 41 b. The local pressure exerted on the electronic element 11 may be also reduced by an elastic deformation of the frame member 12 when the frame member 12 is made of resin.
A fabrication method of the electronic device 40 of a fourth exemplary embodiment other than the step above explained is the same as that of a first exemplary embodiment.
As many apparently widely different exemplary embodiments of the present invention can be made without departing from the spirit and scope thereof, it is to be understood that the invention is not limited to the specific exemplary embodiments thereof except as defined in the appended claims. Also it should be noted that any combination and/or selection of the disclosed and/or claimed elements, matters and/or items may fall under the modifications aforementioned.
The present invention can be applicable preferably to an electronic device having a light receiving portion as a functional portion, for example. Such an electronic device may be used for a DVD player, digital video camera or digital still camera, for example.
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS7276393 *Aug 26, 2004Oct 2, 2007Micron Technology, Inc.Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsUS7397023 *Mar 23, 2006Jul 8, 2008Sharp Kabushiki KaishaImage sensor module with optical path delimiter and accurate alignmentUS7977138 *Feb 16, 2011Jul 12, 2011Panasonic CorporationOptical device and method of manufacturing the sameJP2003068939A Title not available* Cited by examinerClassifications U.S. Classification361/807, 257/701, 257/678, 257/687, 257/684International ClassificationH05K7/04, H05K7/02Cooperative ClassificationH01L2224/97, H01L24/97, H01L2224/16225, H01L21/561, H01L24/16, B81C1/00261, H01L27/14618European ClassificationH01L27/146A6Legal EventsDateCodeEventDescriptionOct 26, 2010ASAssignmentOwner name: RENESAS ELECTRONICS CORPORATION, JAPANEffective date: 20100924Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:UCHIDA, KENJI;REEL/FRAME:025198/0051RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google

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text:
Haiku Jam Limited: Private Company Information - Bloomberg
Company Overview of Haiku Jam Limited
Haiku Jam Limited develops a mobile application through which people create poetic expressions together with words and photos. Its application enables users to connect with friends or strangers anywhere in the world available for Android and iOS devices. The company was founded in 2013 and is based in London, United Kingdom.
www.haikujam.com
Key Executives for Haiku Jam Limited
Haiku Jam Limited does not have any Key Executives recorded.
To contact Haiku Jam Limited, please visit www.haikujam.com. Company data is provided by S&P Global Market Intelligence. Please use this form to report any data issues.

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text:
Patent US5839700 - Articulated fin - Google Patents
An articulated fin of the present invention includes a nose section, a tailection, an upper flexible control surface, and a lower flexible control surface. The upper and lower flexible control surfaces each span from the tail section to the nose section. The fin further includes a gear assembly for applying...http://www.google.com/patents/US5839700?utm_source=gb-gplus-sharePatent US5839700 - Articulated fin
Publication number US5839700 A
Application number US 08/668,605
Publication number 08668605, 668605, US 5839700 A, US 5839700A, US-A-5839700, US5839700 A, US5839700A
Inventors William H. Nedderman, Jr.
Patent Citations (10), Referenced by (29), Classifications (6), Legal Events (5)
Articulated fin
US 5839700 A
An articulated fin of the present invention includes a nose section, a tailection, an upper flexible control surface, and a lower flexible control surface. The upper and lower flexible control surfaces each span from the tail section to the nose section. The fin further includes a gear assembly for applying compressive and tensile forces on the upper and lower flexible control surfaces. The gear assembly bends the tail section upwardly upon applying a tensile force on the upper flexible control surface and a compression force on the lower flexible control surface, and bends the tail section downwardly upon applying a compression force on the upper flexible control surface and a tensile force on the lower flexible control surface.
1. An articulated fin comprising:
a nose section having a forwardly positioned nose block;
a tail section movably attached to the nose section and extending rearwardly therefrom, said tail section having an upper flexible control surface and a lower flexible control surface; and
means for applying compressive and tensile forces on the upper and lower flexible control surfaces, said compressive and tensile force applying means bending the tail section upwardly upon applying a tensile force on the upper flexible control surface and a compressive force on the lower flexible control surface, and bending the tail section downwardly upon applying a compressive force on the upper flexible control surface and a tensile force on the lower flexible control surface, said compressive and tensile force applying means comprises a gear means movable with respect to and mounted on the nose block for applying the compressive and tensile forces on the upper and lower flexible control surfaces;
wherein said gear means comprises:
an actuating gear extending transversely with respect to the direction of the articulated fin; and
a pair of oppositely positioned upper and lower gear segments slidably attached to the nose block, said upper and lower gear segments each having teeth formed on their inwardly facing surface, said teeth being in meshed relationship with teeth formed on the actuating gear, said upper flexible control surface being attached to the upper gear segment at its forward end, and said lower flexible control surface being attached to the lower gear segment at its forward end, said actuating gear, when driven in a clockwise direction, moving said upper and lower gear segments clockwise for moving said tail section downwardly, and, when driven in a counterclockwise direction, moving said upper and lower gear segments counterclockwise for moving said tail section upwardly.
2. The articulated fin of claim 1 wherein said nose block has upper and lower tracks in the form of elongate recesses formed therein, and said upper and lower gear segments being slidably movable in said upper and lower tracks, respectively.
3. The articulated fin of claim 2 wherein said upper and lower tracks are formed opposite one another in said nose block.
4. The articulated fin of claim 3 wherein:
said upper and lower gear segments are each arcuate in shape;
said upper track being arcuate in shape and positioned above said actuating gear; and
said lower track being arcuate in shape and positioned below said actuating gear.
5. The articulated fin of claim 1 wherein said nose block has a pair of oppositely positioned guide surfaces formed adjacent the tail section, said guide surfaces interfering with said upper and lower flexible control surfaces and limiting curvature of said control surfaces when said control surfaces are moved past a preset position.
6. The articulated fin of claim 1 wherein said upper and lower flexible control surfaces are joined integrally with said gear segments, and said upper and lower flexible control surfaces are joined together to form a trailing edge member.
7. An articulated fin comprising:
a tail section movably attached to said nose section and extending rearwardly thereform, said tail section having first and second flexible control surfaces;
an actuating means joined to move said first flexible control surface and said second flexible control surface relative to said nose section;
a gear having gear teeth and positioned on said actuator shaft;
a first rack joined to said tail section first flexible control surface and meshing with said gear;
a second rack joined to said tail section second flexible control surface and meshing with said gear; and
said nose section having an actuator shaft aperture formed therein to allow said actuator shaft to pass therethrough, said nose section further having first and second tracks formed therein with said first rack being slidably positioned in said first track and said second rack being slidably positioned in said second track, said racks moving in said tracks on rotation of said actuator shaft.
8. The articulated fin of claim 7 wherein said first and second racks are arcuate in shape and said first and second tracks are also arcuate in shape.
9. The articulated fin of claim 7 wherein said tail section further comprises a trailing edge element joined at the rear of said tail section between said first flexible surface and said second flexible surface.
10. The articulated fin of claim 9 wherein said tail section including said first and second flexible surfaces, and said trailing edge is formed in one piece.
11. The articulated fin of claim 10 wherein said tail section is formed in one piece with said first rack and said second rack.
This invention relates generally to hydrodynamic and/or aerodynamic fins, and more particularly to an articulated fin which is capable of bending upwardly or downwardly by controlling the tension of its upper and lower surfaces.
There are many different prior art fin designs which are constructed and arranged to change the shape and curvature of the fin for increasing or decreasing its hydrodynamic or aerodynamic resistance. Such fins can be used for many different applications, such as on submersible vessels, torpedoes, and aircraft. One well-known fin design changes its angle of attack by balancing a one-piece airfoil on its actuator shaft. Another well-known fin design has a fixed forward element with a movable rear element that is hinged to the fixed element. The angle of the rear element can be moved to a desired position for increasing or decreasing the resistance of the fin.
Presently, in the field of articulated fins, there are two common modern designs which enable the fin to change its overall shape. The first design incorporates bi-metal strips incorporated within flexible plastic material. This particular fin is actuated by applying electric current to the bi-metal strips which results in the bending of the fin. Thus, by strategically placing the bi-metal strips within the body of the fin, and carefully controlling the temperature of the bi-metal strips, the curvature and shape of the fin can be changed to a desired configuration.
The second well-known articulated fin design is a cable actuated system having leading and trailing edges which are fabricated from flexible material, the leading and trailing edges being connected to one another by a compression member. Cables are routed through the flexible material and anchored to the trailing edge in a position so that there is a pair of cables on either side of the compression member. By pulling the cables on one side, the fin bends at the compression member thereby changing the shape of the fin.
There is presently a need for a new articulated fin design which is simpler in design and more reliable in operation than these two designs.
The instant invention provides an improved articulated fin design which is a significant improvement over prior art fins.
Among the several objects of the present invention are the provision of an improved articulated fin having smooth outer surfaces for achieving optimum hydrodynamic or aerodynamic operation; the provision of such an articulated fin having reduced loading on its drive mechanism; the provision of such an articulated fin which can be easily retrofitted onto existing vehicles having actuator drive shafts; the provision of such an articulated fin which produces reliable results; and the provision of such an articulated fin which is of simple design, and easy to manufacture and operate.
In general, the invention is directed to an improved articulated fin comprising a nose section, a tail section, an upper flexible control surface, and a lower flexible control surface. The upper and lower flexible control surfaces each span from the tail section to the nose section. The fin further comprises means for applying compressive and tensile forces on the upper and lower flexible control surfaces. The compressive and tensile force applying means bends the tail section upwardly upon applying a tensile force on the upper flexible control surface and a compressive force on the lower flexible control surface, and bends the tail section downwardly upon applying a compressive force on the upper flexible control surface and a tensile force on the lower flexible control surface.
More particularly, the nose section has a forwardly positioned nose block, and the compressive and tensile force applying means comprises gear means movable with respect to and mounted on the nose block for applying the compressive and tensile forces on the upper and lower flexible control surfaces. The gear means comprises an actuating gear mounted on a shaft extending transversely with respect to the direction of the articulated fin, and a pair of oppositely positioned upper and lower gear segments which are in meshing relationship with the actuating gear. The actuating gear, when driven in a clockwise direction, moves the upper and lower gear segments clockwise for bending the tail section downwardly. When driven in a counterclockwise direction, the actuating gear moves the upper and lower gear segments counterclockwise for bending the tail section upwardly. The upper flexible control surface is attached to the upper gear segment at its forward end, and, similarly the lower flexible control surface is attached to the lower gear segment at its forward end. The upper and lower gear segments are slidably movable in respective upper and lower tracks formed in the nose block. The upper and lower gear segments and their respective tracks are each arcuate in shape, with the upper gear segment and track being located above the actuating gear and the lower gear segment and track being located below the actuating gear. The upper and lower gear segments each have teeth formed on their inwardly facing surface, the teeth being in meshed relationship with teeth formed on the actuating gear.
FIG. 1 is a cross-sectional view of an articulated fin of the present invention;
FIG. 2 is a cross-sectional view of the articulated fin in a curved position; and
FIG. 3 is a cross-sectional view of an alternate embodiment of the articulated fin.
Referring to FIGS. 1 and 2, there is generally indicated at 10 an articulated fin of the present invention, the fin 10 being designed for use on submersible vessels, torpedoes, aircraft, and the like. Fins are well-known in the art for their ability to change the hydrodynamic or aerodynamic properties by modifying their angle of attack or shape. The fin 10 illustrated in FIGS. 1 and 2 is especially suited for use on an unmanned underwater vehicle such as a torpedo having a drive shaft which extends in a direction generally transverse to the direction of the fin. This aspect of the present invention will become apparent as the description of the fin 10 proceeds.
As shown, the fin 10 has a forward nose section, generally indicated at 12, and a rearward tail section, generally indicated at 14. The tail section 14 is capable of bending or curving upwardly and downwardly for increasing the hydrodynamic or aerodynamic resistance forces. The nose section 12 is designed so that it maintains its orientation with respect to the vehicle. The nose section 12 includes a nose block 16 which has a forwardly curved surface 18 with a flow resistance minimizing profile, and oppositely positioned top and bottom guide surfaces 20, 22 formed on the nose section's rearward end adjacent the tail section 14. The nose block 16 is suitably attached to a fin base 24 of the vehicle for mounting the fin 10 thereto (see FIG. 2).
The tail section 14 is fabricated from a pair of oppositely positioned, upper and lower flexible control walls or surfaces 26, 28 which each span from the rearward end of the tail section 14 to the rearward end of the nose section 12. Preferably, the control surfaces 26, 28 are constructed of flexible, yet somewhat rigid fiberglass and/or plastic since the tail section 14 must be sufficiently flexible so that it can assume the curved configuration illustrated in FIG. 2. The rearward ends of the control surfaces 26, 28 are secured to one another by a trailing edge member 30. Any suitable fastener can be provided for joining the rearward adjacent ends of the control surfaces 26, 28 to the trailing edge member 30.
Generally indicated at 32 is a gear assembly which provides the necessary means for applying compressive and tensile forces on the upper and lower control surfaces 26, 28 to change the shape of the fin 10. More specifically, the gear assembly 32 of the present invention bends the tail section 14 upwardly upon applying a tensile force on the upper control surface 26 and a compressive force on the lower control surface 28, and bends the tail section 14 downwardly upon applying a compressive force on the upper control surface 26 and a tensile force on the lower control surface 28. FIG. 2 illustrates the gear assembly 32 applying a compressive force on the upper control surface 26 and a tensile force on the lower control surface 28 thereby resulting in the tail section 14 bending or curving downwardly with respect to the nose section 12.
The gear assembly 32 comprises an actuating gear 34 which is mounted on a shaft 36 of the fin base 24 that extends transversely with respect to the direction of the fin 10, and a pair of oppositely positioned, upper and lower arcuately-shaped gear segments 38, 40 which mesh with the actuating gear 34. As shown, the actuating gear 34 has a first set of upwardly facing teeth 42 which mesh with a mating set of teeth 44 formed in the inwardly facing surface of the upper gear segment 38, and a second set of downwardly facing teeth 46 which mesh with a mating set of teeth 48 formed in the inwardly facing surface of the lower gear segment 40. The arrangement is such that when driving the actuating gear 34 in a clockwise direction, the upper and lower gear segments 38, 40 are likewise driven clockwise for moving the tail section 14 downwardly. Conversely, when driving the actuating gear 34 in a counterclockwise direction, the upper and lower gear segments 38, 40 are also driven counterclockwise for moving the tail section 14 upwardly.
More particularly, the upper and lower gear segments 38, 40 are each received in respective upper and lower tracks 50, 52 which are formed in the nose block 16 of the nose section 14 as elongate recesses in opposing relation with each other. As shown, the tracks 50, 52 are similarly shaped and longer in length with respect to their respective gear segment 38, 40. The tracks 50, 52 are positioned in the nose block 16 so that when they receive their respective gear segments 38, 40, the gear segments are adjacent the control surfaces 26, 28. In this regard, the upper and lower control surfaces 26, 28 are attached to their respective upper and lower gear segments 38, 40 at 54, 56, respectively, in any suitable manner (e.g., by a fastener, rivet, etc.). It should be observed that the attachment of the upper and lower control surfaces 26, 28 to their respective gear segments 38, 40 provides a continuous surface between the nose section and the tail section which is important for improving the dynamic characteristics of the fin. Notches (not designated) are formed in the gear segments 38, 40 for facilitating the continuous outer surfaces of the fin 10, the terminal edges of the control surfaces 26, 28 abutting the notches of the gear segments.
Referring to FIG. 1, the fin 10 is illustrated in its optimal hydrodynamic or aerodynamic position in which the tail section 14 extends along a line generally parallel with respect to the nose section 12. The fin 10 is supported in this position by the fin base 24 (see FIG. 2) in any suitable manner. As shown, the upper and lower control surfaces 26, 28 are in a neutral position wherein neither of them are subjected to compressive or tensile forces.
To move the tail section 14 of the fin 10 downwardly as illustrated in FIG. 2, the actuating gear 34 is rotated in clockwise direction. The actuating gear 34 moves the upper gear segment 38 within the upper track 50 from a generally central position (FIG. 1) to a right-hand position (FIG. 2). This results in a compressive force being applied to the upper control surface 26 and a tensile force being applied to the lower control surface 28. Reference can be made to the offset relationship between the leading edges of the control surfaces 26, 28, the lower control surface leading edge being positioned forward of the upper control surface leading edge. The compressive and tensile forces on the upper and lower control surfaces 26, 28, respectively, bend or curve the tail section 14 downwardly. The movement of the tail section 14 is controlled by the top guide surface 20 of the nose block 16 which engages the underside of the upper control surface 26 for ceasing or limiting its movement.
It should be understood that the movement of the tail section 14 upwardly with respect to the nose section 12 can easily be accomplished in the reverse manner, i.e., by rotating the actuating gear 34 in a counterclockwise direction. The bottom guide surface 22, in this situation, limits the movement of the tail section 14 since it engages the underside of the lower control surface 28.
It should be observed that the articulated fin 10 of the present invention is especially effective in moving the tail section 14 in any desired position since the gear assembly 32 provides positive movement which is lacking in the temperature sensitive articulated fins of the prior art. Moreover, the integrity of the fin's outer surfaces is maintained by the attachment of the upper and lower control surfaces 26, 28 to respective upper and lower gear segments 38, 40 and by the operation of the gear assembly 32.
While there is shown and described herein certain specific structure embodying the invention, it will be manifest to those skilled in the art that various modifications and rearrangements of the parts may be made without departing from the spirit and scope of the underlying inventive concept and that the same is not limited to the particular forms herein shown and described except insofar as indicated by the scope of the appended claims. Although the terms "upper" and "lower" have been used throughout this specification, this fin can obviously be used in either a horizontal or vertical configuration.
More particularly, a production version of this invention can be made using a one piece gear segment, control surface and trailing edge member assembly as shown in FIG. 3. It is envisioned that rearward tail section 14 could be made as a one piece casting from durometer polyurethane or another elastomeric material. This construction may provide superior fluid flow characteristics. FIG. 3 shows the invention as installed with rearward tail section 14 having integral gear segments 38 and 40 and control surfaces 26 and 28 joined to an integral trailing edge member 30.
US1856578 * May 5, 1930 May 3, 1932 Felix Ladeveze Aeroplane
US3332383 * Jun 24, 1965 Jul 25, 1967 Wright Edward Morris Variable camber airfoil
US4096817 * Jun 17, 1976 Jun 27, 1978 Societe Nationale Industrielle Aerospatiale Supporting foil for a hydrofoil comprising at least one deformable part
US5367970 * Sep 27, 1993 Nov 29, 1994 The United States Of America As Represented By The Secretary Of The Navy Controllable camber fin
US5487351 * Jan 13, 1995 Jan 30, 1996 The United States Of America As Represented By The Secretary Of The Navy Control surface for underwater vehicle
US6095457 * Dec 14, 1998 Aug 1, 2000 Vanmoor; Arthur Airfoil and wing configuration
US6474184 * May 25, 2001 Nov 5, 2002 Eads Deutschland Gmbh Tilt and swivel positioning device
US7108231 Apr 14, 2004 Sep 19, 2006 Eads Deutschland Gmbh Adjustment mechanism for a variable-shape wing
US9199718 * Feb 12, 2012 Dec 1, 2015 Shaun P. Fogarty Auto-rotating device
US20050103945 * Apr 14, 2004 May 19, 2005 Eads Deutschland Gmbh Adjustment mechanism for a variable-shape wing
US20120104181 * Nov 2, 2010 May 3, 2012 Matthew Boyd Rix Cross-Sectionally Morphing Airfoil
US20120328441 * Feb 12, 2012 Dec 27, 2012 Fogarty Shaun P Auto-rotating device
EP2256032A3 * May 21, 2010 Nov 14, 2012 Deutsches Zentrum für Luft- und Raumfahrt e.V. Aerodynamic component with deformable skin
U.S. Classification 244/219, 114/140, 114/127
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NEDDERMAN, WILLIAM H. JR.;REEL/FRAME:008075/0856


text:
Toronto mayor appears on 'Jimmy Kimmel Live' | Daily Mail Online
Published: 02:39 EDT, 4 March 2014 | Updated: 02:39 EDT, 4 March 2014
TORONTO (AP) — Embattled Toronto Mayor Rob Ford laughed off Jimmy Kimmel's suggestion that he get help for his drinking problem and was reported to be upset about his appearance on the late night TV talk show.
Ford and Kimmel earlier left their seats during the segment to watch a series of videos depicting the mayor of Canada's largest city in a variety of embarrassing scenes, including a cell phone video of Ford ranting about wanting to kill someone. Ford said he didn't know who he was talking about in the video.

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Choices Alternative High School in Ropesville, TX with Reviews - YP.com
Ropesville, TX Choices Alternative High School
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text: the right environment is the most important. how we can create this environment today with this kind of unstability, we need political stability. we need peace. we have struggle between the palestinians and israelis and egypt. we have to talk about it and be very frank to see how we can get to the end of this. for this reason, yes, frankly speaking i'm not very optimistic about all today. if i ask anyone what you want me to talk to about, talk about democracy, freedom, transparency, governments, rulers. let us work for this and this is very important. >> let me ask --, let me ask someone who has worked with some of these institutions under the most ex-rd nary conditions. you have helped functioning institution in the west bank. you created an economy that created extraordinary growth over the last three years and you've done it under very adverse circumstances. so what would be your advice to people trying to build these institutions? >> thank you. honestly i continue to the effort help the institutions not just myself and to get ready for the emergence of fully independent and state Search Results 0 to 49 of about 77 (some duplicates have been removed)First<12 >Last


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Leica 90mm Tele-Elmarit Canada | eBay
Details about Leica 90mm Tele-Elmarit Canada
Leica 90mm Tele-Elmarit Canada
Bright and Beautiful New Mexico , United States
breadmasta
Sell one like this	More chances to get what you wantFeedback on our suggestions*Excellent* Leica Tele Elmarit M 90mm f/2.8 Canada from Japan #0433$479.00+ $30.00 Leica Leitz Canada 90mm f/2.8 Fat Tele-Elmarit M Mount Telephoto Prime Lens$213.50Free shipping8 bids LEICA M TELE ELMARIT 90MM F2.8 CANADA 90/2.8 LENS Leitz$325.00Free shipping Leica Tele-Elmarit-M 90 mm F/2.8 FAT version for M-Mount box$105.50+ $25.004 bids LEICA 90mm 2.8 Tele-Elmarit M Lens SN 2728361 Made in Canada$239.90+ $27.00 LEICA ELMARIT 90mm f2.8 LENS - M MOUNT - 1965 - LOVELY!$487.83+ $24.33 Leica 90mm Elmarit f2.8 for Leica M mount cameras$385.00+ $12.00 LEICA 90MM TELE-ELMARIT F2.8 M MAYONET CHROME 'FAT' 1ST VERSION LENS$795.00+ $35.00 LEICA LEITZ 90mm TELE-ELMARIT F2.8 1ST V 'FAT' CHROME M LENS$795.00+ $35.00 Leica Leitz Tele-Elmarit 90mm f/2.8 + Summicron 50mm F2 Empty Lens Box Only Lot$69.99Free shipping Leica M4 Leica Elmarit M 135mm f2.8 Tele lens w/ Eyes Fits Leica M3, M6, M9$375.00+ $19.00 Leitz / Leica 90 mm f/2.8 Tele-Elmarit Leica-M rangefinder lens$600.00Free shipping Description
eBay item number:290706318155

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Data jobs home Jobs, Employment | Freelancer.com
Data jobs home jobs
data jobs home
3,583 data jobs home jobs found, pricing in USD
...process of buying and selling a home interesting and fun, rather than dry and boring. Homewell addresses moving factors that other platforms don't and provides additional resources that provide more value to homes and communities. There is more to a home than the actual structure people live in. Homewell hopes to define what "home" truly means to people.
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value: This website is an Australian freelance marketplace website, which allows potential employers to post jobs that freelancers can then bid to complete. Founded in 2009, its headquarters is located in Sydney, Australia, though it also has offices in Vancouver, London, Buenos Aires, Manila, and Jakarta.


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Do on Pinterest | Twin Birth Announcements, Business Cards and Stamps
Logos, Stationery & Design
The kane tsugi (literally, right-angle corner) joint is a traditional Japanese joint that offers incredible strength and beauty.
Right Angled Corner, Traditional Japanese, Incredibles Strength, Offering Incredibles, Japanese Carpentry, Kane Tsugi, Japanese Jointed, Japanese Joinery, Japanese Wood Joinery
The kane tsugi (literally, right-angle corner) joint - traditional Japanese joinery
Character Design References, Hands Sketches, Hand Drawings, Gesture Sketches, Drawing Hands, Art Law, Prog Work, Hands Drawing, Awesome Drawing
Hands- the defiers of every art law out there.
Hand drawings with different perspectives
prog [WORK] ress #Hand #Sketch
hand gestures sketching
Portfolio Design, Diy Folder, Design Inspiration, Bookbinding Ideas, Simple Binding, Graphics Design Leaves Behind, Book Binding Ideas, Josefin Holgersson, Binder Ideas
Josefin Holgersson — Designspiration #Bookbinding ideas and #Inspiration
Portfolio Binder Idea.
Booklet Ud 130918 Zin, Art Zine, Sheet O' Pap, Crafts Ideas, Folding Paper Book, Diy Zines, Single Sheet, Fanzine Layout, Fanzines Diy
making a mini-booklet from a single sheet of paper
Cartography by Louisa Boyd, via Susan Angebranndt
Maps Folding, Book Style, Turkish Maps, Diy Bookmaking, Angebranndt Flowerfold, Artists Book, Handmade Origami Books, Diy Books Binding, Folding Maps
Beautiful. This artist book's style is similar to an origami water lily book we had fun making one afternoon. So many possibilities for the text block! Cartography by Louisa Boyd, via Susan Angebranndt
Cartography by Louisa Boyd, via Susan Angebranndt Flowerfold? Accordion
Turkish map fold book- Louisa Boyd
Louisa Boyd : Green Chair Press Blog
Writing Personal Narrative, Teaching Personal Narrative, Narrative Writing Lesson, Writing Workshop Anchor Chart, Writing Narrative, Writers Workshop Anchor Chart, Narrative Writing Example, Narrative Anchor Chart, Teach Personal Narrative
Annotating Anchors, Annotating A Text 5Th Grade, Close Reading Annotations, 4Th Graders, Reader Response, Anchors Charts, Reading Annotating, Nonfiction Close Reading, 2Nd Grade
narrow for 2nd grade
want to start doing something similar w/my 4th graders
Reader's response notations
Close reading annotations anchor chart
Have you ever seen this anchor chart for prepositions and wished you had a copy to print off yourself? Now you can!!!
Sweet diy tea towel stamping tutorial from Amy Rowan via Larks and Japes
Teas Towels, Tea Towels, Stamps Tutorials, Crafts Idease Sewing, Amy Rowan, Sweets Diy, Diy Teatowel, Teatowel Stamps, Diy Teas
Sweet #DIY #teatowel stamping tutorial from Amy Rowan via Larks and Japes
Doityourself Gift, Diy Art, Gift Wrapping, Potatoes Prints, Gift Wraps, Diy Gifts, Handmade Gift, Gift Diy, Potatoes Stamps Art
How to draw an eye #diy #crafts
YUMMY little watermelon slice brooch, hand-stitched in Melbourne by theTriangleOfBears
Chocolates Trifles, Watermelon Pin, Minis Dog Qu, Minis Watermelon, Slices Brooches, Felt Watermelon, Leather Brooches, Hands Stitches, Watermelon Slices
Felt & Fake Leather Brooch Watermelon Slice by theTriangleOfBears, $8.00
Felt Watermelon Slice Brooch
mini watermelon pin.
YUMMY-Little Hand Stitch Watermelon
Egypt - Imgur
Politics, Egyptian Protest, Muslim Brotherhood, America, Columns, Birds, People, Medium, Barack Obama
Israel's Political Wisdom Ignored during Arab protests! REPIN if Obama has no clue about the Arab world!
I THINK THE EGYPTIAN PEOPLE ARE FED UP WITH THE MUSLIM BROTHERHOOD AND MORSI.
Obama officials to offer Muslim Brotherhood top positions in Egypt... IS THIS NOT AMAZING THAT WE HAVE A PRESIDENT WHO IS BASICALLY GIVING THE "BIRD" TO THE U.S. TAXPAYERS AND THEIR BEST INTERESTS! DOES EGYPT REALLY NEED TERRORISTS IN THEIR GOVERNMENT? I DON'T THINK SO!
From the Egyptian Protests - They know what the Muslim Brotherhood (Obama's bud's) represents.
Make a floating heart backdrop. cueva barcelona estrellas
Protect your plants by recycling plastic bottles and adding a touch of style

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