Daily Papers

Reinforcement learning (RL) is a machine learning paradigm where an autonomous agent learns to make an optimal sequence of decisions by interacting with the underlying environment. The promise demonstrated by RL-guided workflows in unraveling electronic design automation problems has encouraged hardware security researchers to utilize autonomous RL agents in solving domain-specific problems. From the perspective of hardware security, such autonomous agents are appealing as they can generate optimal actions in an unknown adversarial environment. On the other hand, the continued globalization of the integrated circuit supply chain has forced chip fabrication to off-shore, untrustworthy entities, leading to increased concerns about the security of the hardware. Furthermore, the unknown adversarial environment and increasing design complexity make it challenging for defenders to detect subtle modifications made by attackers (a.k.a. hardware Trojans). In this brief, we outline the development of RL agents in detecting hardware Trojans, one of the most challenging hardware security problems. Additionally, we outline potential opportunities and enlist the challenges of applying RL to solve hardware security problems.

Advancements in high-computing devices increase the necessity for improved and new understanding and development of smart manufacturing factories. Discrete-event models with simulators have been shown to be critical to architect, designing, building, and operating the manufacturing of semiconductor chips. The diffusion, implantation, and lithography machines have intricate processes due to their feedforward and feedback connectivity. The dataset collected from simulations of the factory models holds the promise of generating valuable machine-learning models. As surrogate data-based models, their executions are highly efficient compared to the physics-based counterpart models. For the development of surrogate models, it is beneficial to have publicly available benchmark simulation models that are grounded in factory models that have concise structures and accurate behaviors. Hence, in this research, a dataset is devised and constructed based on a benchmark model of an Intel semiconductor fabrication factory. The model is formalized using the Parallel Discrete-Event System Specification and executed using the DEVS-Suite simulator. The time series dataset is constructed using discrete-event time trajectories. This dataset is further analyzed and used to develop baseline univariate and multivariate machine learning models. The dataset can also be utilized in the machine learning community for behavioral analysis based on formalized and scalable component-based discrete-event models and simulations.

The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and return a Wafer Defect Map (WDM), i.e., a list of the coordinates where defects lie, which can be considered a huge, sparse, and binary image. In normal conditions, wafers exhibit a small number of randomly distributed defects, while defects grouped in specific patterns might indicate known or novel categories of failures in the production line. Needless to say, a primary concern of semiconductor industries is to identify these patterns and intervene as soon as possible to restore normal production conditions. Here we address WDM monitoring as an open-set recognition problem to accurately classify WDM in known categories and promptly detect novel patterns. In particular, we propose a comprehensive pipeline for wafer monitoring based on a Submanifold Sparse Convolutional Network, a deep architecture designed to process sparse data at an arbitrary resolution, which is trained on the known classes. To detect novelties, we define an outlier detector based on a Gaussian Mixture Model fitted on the latent representation of the classifier. Our experiments on a real dataset of WDMs show that directly processing full-resolution WDMs by Submanifold Sparse Convolutions yields superior classification performance on known classes than traditional Convolutional Neural Networks, which require a preliminary binning to reduce the size of the binary images representing WDMs. Moreover, our solution outperforms state-of-the-art open-set recognition solutions in detecting novelties.

Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial for determining the root cause of production defects, which may further provide insight for yield improvement in wafer foundry. During manufacturing, various defects may appear standalone in the wafer or may appear as different combinations. Identifying multiple defects in a wafer is generally harder compared to identifying a single defect. Recently, deep learning methods have gained significant traction in mixed-type DPR. However, the complexity of defects requires complex and large models making them very difficult to operate on low-memory embedded devices typically used in fabrication labs. Another common issue is the unavailability of labeled data to train complex networks. In this work, we propose an unsupervised training routine to distill the knowledge of complex pre-trained models to lightweight deployment-ready models. We empirically show that this type of training compresses the model without sacrificing accuracy despite being up to 10 times smaller than the teacher model. The compressed model also manages to outperform contemporary state-of-the-art models.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

Large Language Models (LLMs) have demonstrated the potential to address some issues within the semiconductor industry. However, they are often general-purpose models that lack the specialized knowledge needed to tackle the unique challenges of this sector, such as the intricate physics and chemistry of semiconductor devices and processes. SemiKong, the first industry-specific LLM for the semiconductor domain, provides a foundation that can be used to develop tailored proprietary models. With SemiKong 1.0, we aim to develop a foundational model capable of understanding etching problems at an expert level. Our key contributions include (a) curating a comprehensive corpus of semiconductor-related texts, (b) creating a foundational model with in-depth semiconductor knowledge, and (c) introducing a framework for integrating expert knowledge, thereby advancing the evaluation process of domain-specific AI models. Through fine-tuning a pre-trained LLM using our curated dataset, we have shown that SemiKong outperforms larger, general-purpose LLMs in various semiconductor manufacturing and design tasks. Our extensive experiments underscore the importance of developing domain-specific LLMs as a foundation for company- or tool-specific proprietary models, paving the way for further research and applications in the semiconductor domain. Code and dataset will be available at https://github.com/aitomatic/semikong

Identifying defect patterns in a wafer map during manufacturing is crucial to find the root cause of the underlying issue and provides valuable insights on improving yield in the foundry. Currently used methods use deep neural networks to identify the defects. These methods are generally very huge and have significant inference time. They also require GPU support to efficiently operate. All these issues make these models not fit for on-line prediction in the manufacturing foundry. In this paper, we propose an extremely simple yet effective technique to extract features from wafer images. The proposed method is extremely fast, intuitive, and non-parametric while being explainable. The experiment results show that the proposed pipeline outperforms conventional deep learning models. Our feature extraction requires no training or fine-tuning while preserving the relative shape and location of data points as revealed by our interpretability analysis.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Precision in identifying nanometer-scale device-killer defects is crucial in both semiconductor research and development as well as in production processes. The effectiveness of existing ML-based approaches in this context is largely limited by the scarcity of data, as the production of real semiconductor wafer data for training these models involves high financial and time costs. Moreover, the existing simulation methods fall short of replicating images with identical noise characteristics, surface roughness and stochastic variations at advanced nodes. We propose a method for generating synthetic semiconductor SEM images using a diffusion model within a limited data regime. In contrast to images generated through conventional simulation methods, SEM images generated through our proposed DL method closely resemble real SEM images, replicating their noise characteristics and surface roughness adaptively. Our main contributions, which are validated on three different real semiconductor datasets, are: i) proposing a patch-based generative framework utilizing DDPM to create SEM images with intended defect classes, addressing challenges related to class-imbalance and data insufficiency, ii) demonstrating generated synthetic images closely resemble real SEM images acquired from the tool, preserving all imaging conditions and metrology characteristics without any metadata supervision, iii) demonstrating a defect detector trained on generated defect dataset, either independently or combined with a limited real dataset, can achieve similar or improved performance on real wafer SEM images during validation/testing compared to exclusive training on a real defect dataset, iv) demonstrating the ability of the proposed approach to transfer defect types, critical dimensions, and imaging conditions from one specified CD/Pitch and metrology specifications to another, thereby highlighting its versatility.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

Industry 4.0 has revolutionized manufacturing by driving digitalization and shifting the paradigm toward additive manufacturing (AM). Fused Deposition Modeling (FDM), a key AM technology, enables the creation of highly customized, cost-effective products with minimal material waste through layer-by-layer extrusion, posing a significant challenge to traditional subtractive methods. However, the susceptibility of material extrusion techniques to errors often requires expert intervention to detect and mitigate defects that can severely compromise product quality. While automated error detection and machine learning models exist, their generalizability across diverse 3D printer setups, firmware, and sensors is limited, and deep learning methods require extensive labeled datasets, hindering scalability and adaptability. To address these challenges, we present a process monitoring and control framework that leverages pre-trained Large Language Models (LLMs) alongside 3D printers to detect and address printing defects. The LLM evaluates print quality by analyzing images captured after each layer or print segment, identifying failure modes and querying the printer for relevant parameters. It then generates and executes a corrective action plan. We validated the effectiveness of the proposed framework in identifying defects by comparing it against a control group of engineers with diverse AM expertise. Our evaluation demonstrated that LLM-based agents not only accurately identify common 3D printing errors, such as inconsistent extrusion, stringing, warping, and layer adhesion, but also effectively determine the parameters causing these failures and autonomously correct them without any need for human intervention.

In the rapidly evolving semiconductor industry, where research, design, verification, and manufacturing are intricately linked, the potential of Large Language Models to revolutionize hardware design and security verification is immense. The primary challenge, however, lies in the complexity of hardware specific issues that are not adequately addressed by the natural language or software code knowledge typically acquired during the pretraining stage. Additionally, the scarcity of datasets specific to the hardware domain poses a significant hurdle in developing a foundational model. Addressing these challenges, this paper introduces Hardware Phi 1.5B, an innovative large language model specifically tailored for the hardware domain of the semiconductor industry. We have developed a specialized, tiered dataset comprising small, medium, and large subsets and focused our efforts on pretraining using the medium dataset. This approach harnesses the compact yet efficient architecture of the Phi 1.5B model. The creation of this first pretrained, hardware domain specific large language model marks a significant advancement, offering improved performance in hardware design and verification tasks and illustrating a promising path forward for AI applications in the semiconductor sector.

While Large Language Models (LLMs) demonstrate immense potential for automating integrated circuit (IC) development, their practical deployment is fundamentally limited by restricted context windows. Existing context-extension methods struggle to achieve effective semantic modeling and thorough multi-hop reasoning over extensive, intricate circuit specifications. To address this, we introduce ChipMind, a novel knowledge graph-augmented reasoning framework specifically designed for lengthy IC specifications. ChipMind first transforms circuit specifications into a domain-specific knowledge graph ChipKG through the Circuit Semantic-Aware Knowledge Graph Construction methodology. It then leverages the ChipKG-Augmented Reasoning mechanism, combining information-theoretic adaptive retrieval to dynamically trace logical dependencies with intent-aware semantic filtering to prune irrelevant noise, effectively balancing retrieval completeness and precision. Evaluated on an industrial-scale specification reasoning benchmark, ChipMind significantly outperforms state-of-the-art baselines, achieving an average improvement of 34.59% (up to 72.73%). Our framework bridges a critical gap between academic research and practical industrial deployment of LLM-aided Hardware Design (LAD).

In 2020, we introduced a deep reinforcement learning method capable of generating superhuman chip layouts, which we then published in Nature and open-sourced on GitHub. AlphaChip has inspired an explosion of work on AI for chip design, and has been deployed in state-of-the-art chips across Alphabet and extended by external chipmakers. Even so, a non-peer-reviewed invited paper at ISPD 2023 questioned its performance claims, despite failing to run our method as described in Nature. For example, it did not pre-train the RL method (removing its ability to learn from prior experience), used substantially fewer compute resources (20x fewer RL experience collectors and half as many GPUs), did not train to convergence (standard practice in machine learning), and evaluated on test cases that are not representative of modern chips. Recently, Igor Markov published a meta-analysis of three papers: our peer-reviewed Nature paper, the non-peer-reviewed ISPD paper, and Markov's own unpublished paper (though he does not disclose that he co-authored it). Although AlphaChip has already achieved widespread adoption and impact, we publish this response to ensure that no one is wrongly discouraged from innovating in this impactful area.

This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous empirical and experimental evaluation to rank these varying techniques. For the empirical evaluation, we assess techniques based on a set of five criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field

The rise of on-chip accelerators signifies a major shift in computing, driven by the growing demands of artificial intelligence (AI) and specialized applications. These accelerators have gained popularity due to their ability to substantially boost performance, cut energy usage, lower total cost of ownership (TCO), and promote sustainability. Intel's Advanced Matrix Extensions (AMX) is one such on-chip accelerator, specifically designed for handling tasks involving large matrix multiplications commonly used in machine learning (ML) models, image processing, and other computational-heavy operations. In this paper, we introduce a novel value-dependent timing side-channel vulnerability in Intel AMX. By exploiting this weakness, we demonstrate a software-based, value-dependent timing side-channel attack capable of inferring the sparsity of neural network weights without requiring any knowledge of the confidence score, privileged access or physical proximity. Our attack method can fully recover the sparsity of weights assigned to 64 input elements within 50 minutes, which is 631% faster than the maximum leakage rate achieved in the Hertzbleed attack.

Stealthy hardware Trojans (HTs) inserted during the fabrication of integrated circuits can bypass the security of critical infrastructures. Although researchers have proposed many techniques to detect HTs, several limitations exist, including: (i) a low success rate, (ii) high algorithmic complexity, and (iii) a large number of test patterns. Furthermore, the most pertinent drawback of prior detection techniques stems from an incorrect evaluation methodology, i.e., they assume that an adversary inserts HTs randomly. Such inappropriate adversarial assumptions enable detection techniques to claim high HT detection accuracy, leading to a "false sense of security." Unfortunately, to the best of our knowledge, despite more than a decade of research on detecting HTs inserted during fabrication, there have been no concerted efforts to perform a systematic evaluation of HT detection techniques. In this paper, we play the role of a realistic adversary and question the efficacy of HT detection techniques by developing an automated, scalable, and practical attack framework, ATTRITION, using reinforcement learning (RL). ATTRITION evades eight detection techniques across two HT detection categories, showcasing its agnostic behavior. ATTRITION achieves average attack success rates of 47times and 211times compared to randomly inserted HTs against state-of-the-art HT detection techniques. We demonstrate ATTRITION's ability to evade detection techniques by evaluating designs ranging from the widely-used academic suites to larger designs such as the open-source MIPS and mor1kx processors to AES and a GPS module. Additionally, we showcase the impact of ATTRITION-generated HTs through two case studies (privilege escalation and kill switch) on the mor1kx processor. We envision that our work, along with our released HT benchmarks and models, fosters the development of better HT detection techniques.

The risks of frontier AI may require international cooperation, which in turn may require verification: checking that all parties follow agreed-on rules. For instance, states might need to verify that powerful AI models are widely deployed only after their risks to international security have been evaluated and deemed manageable. However, research on AI verification could benefit from greater clarity and detail. To address this, this report provides an in-depth overview of AI verification, intended for both policy professionals and technical researchers. We present novel conceptual frameworks, detailed implementation options, and key R&D challenges. These draw on existing literature, expert interviews, and original analysis, all within the scope of confidentially overseeing AI development and deployment that uses thousands of high-end AI chips. We find that states could eventually verify compliance by using six largely independent verification approaches with substantial redundancy: (1) built-in security features in AI chips; (2-3) separate monitoring devices attached to AI chips; and (4-6) personnel-based mechanisms, such as whistleblower programs. While promising, these approaches require guardrails to protect against abuse and power concentration, and many of these technologies have yet to be built or stress-tested. To enable states to confidently verify compliance with rules on large-scale AI development and deployment, the R&D challenges we list need significant progress.

Perovskite solar cells (PSCs) have rapidly emerged as a leading contender in next-generation photovoltaic technologies, owing to their exceptional power conversion efficiencies and advantageous material properties. Despite these advances, challenges such as long-term stability, environmental sustainability, and scalable manufacturing continue to hinder their commercialization. Precursor additive engineering has shown promise in addressing these issues by enhancing both the performance and durability of PSCs. However, the explosive growth of scientific literature and the complex interplay of materials, processes, and device architectures make it increasingly difficult for researchers to efficiently access, organize, and utilize domain knowledge in this rapidly evolving field. To address this gap, we introduce Perovskite-R1, a specialized large language model (LLM) with advanced reasoning capabilities tailored for the discovery and design of PSC precursor additives. By systematically mining and curating 1,232 high-quality scientific publications and integrating a comprehensive library of 33,269 candidate materials, we constructed a domain-specific instruction-tuning dataset using automated question-answer generation and chain-of-thought reasoning. Fine-tuning the QwQ-32B model on this dataset resulted in Perovskite-R1, which can intelligently synthesize literature insights and generate innovative and practical solutions for defect passivation and the selection of precursor additives. Experimental validation of several model-proposed strategies confirms their effectiveness in improving material stability and performance. Our work demonstrates the potential of domain-adapted LLMs in accelerating materials discovery and provides a closed-loop framework for intelligent, data-driven advancements in perovskite photovoltaic research.

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

Superconducting Digital (SCD) technology offers significant potential for enhancing the performance of next generation large scale compute workloads. By leveraging advanced lithography and a 300 mm platform, SCD devices can reduce energy consumption and boost computational power. This paper presents a cross-layer modeling approach to evaluate the system-level performance benefits of SCD architectures for Large Language Model (LLM) training and inference. Our findings, based on experimental data and Pulse Conserving Logic (PCL) design principles, demonstrate substantial performance gain in both training and inference. We are, thus, able to convincingly show that the SCD technology can address memory and interconnect limitations of present day solutions for next-generation compute systems.

Printed Circuit Board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasingly evolving so new techniques are required to overcome the emerging problems. Existing ML-based methods outperform traditional CV methods, however they often require more data, have low explainability, and can be difficult to adapt when a new technology arises. To overcome these challenges, CV methods can be used in tandem with ML methods. In particular, human-interpretable CV algorithms such as those that extract color, shape, and texture features increase PCB assurance explainability. This allows for incorporation of prior knowledge, which effectively reduce the number of trainable ML parameters and thus, the amount of data needed to achieve high accuracy when training or retraining an ML model. Hence, this study explores the benefits and limitations of a variety of common computer vision-based features for the task of PCB component detection using semantic data. Results of this study indicate that color features demonstrate promising performance for PCB component detection. The purpose of this paper is to facilitate collaboration between the hardware assurance, computer vision, and machine learning communities.

LLMs have shown early promise in generating RTL code, yet evaluating their capabilities in realistic setups remains a challenge. So far, RTL benchmarks have been limited in scale, skewed toward trivial designs, offering minimal verification rigor, and remaining vulnerable to data contamination. To overcome these limitations and to push the field forward, this paper introduces NotSoTiny, a benchmark that assesses LLM on the generation of structurally rich and context-aware RTL. Built from hundreds of actual hardware designs produced by the Tiny Tapeout community, our automated pipeline removes duplicates, verifies correctness and periodically incorporates new designs to mitigate contamination, matching Tiny Tapeout release schedule. Evaluation results show that NotSoTiny tasks are more challenging than prior benchmarks, emphasizing its effectiveness in overcoming current limitations of LLMs applied to hardware design, and in guiding the improvement of such promising technology.

Complementary metal-oxide semiconductor (CMOS) technology has radically reshaped the world by taking humanity to the digital age. Cramming more transistors into the same physical space has enabled an exponential increase in computational performance, a strategy that has been recently hampered by the increasing complexity and cost of miniaturization. To continue achieving significant gains in computing performance, new computing paradigms, such as quantum computing, must be developed. However, finding the optimal physical system to process quantum information, and scale it up to the large number of qubits necessary to build a general-purpose quantum computer, remains a significant challenge. Recent breakthroughs in nanodevice engineering have shown that qubits can now be manufactured in a similar fashion to silicon field-effect transistors, opening an opportunity to leverage the know-how of the CMOS industry to address the scaling challenge. In this article, we focus on the analysis of the scaling prospects of quantum computing systems based on CMOS technology.

Emerging AI accelerators increasingly adopt wafer-scale manufacturing technologies, integrating hundreds of thousands of AI cores in a mesh architecture with large distributed on-chip memory (tens of GB in total) and ultra-high on-chip memory bandwidth (tens of PB/s). However, current LLM inference systems, optimized for shared memory architectures like GPUs, fail to exploit these accelerators fully. We introduce WaferLLM, the first wafer-scale LLM inference system. WaferLLM is guided by a novel PLMR model (pronounced as "Plummer") that captures the unique hardware characteristics of wafer-scale architectures. Leveraging this model, WaferLLM pioneers wafer-scale LLM parallelism, optimizing the utilization of hundreds of thousands of on-chip cores. It also introduces MeshGEMM and MeshGEMV, the first GEMM and GEMV implementations designed to scale effectively on wafer-scale accelerators. Evaluations show that WaferLLM achieves up to 200times higher accelerator utilization than state-of-the-art methods. Leveraging a wafer-scale accelerator (Cerebras WSE2), WaferLLM delivers GEMV operations 606times faster and 16times more energy-efficient than on an NVIDIA A100 GPU. For full LLM inference, WaferLLM achieves 10-20times speedups over A100 GPU clusters running SGLang and vLLM. These advantages are expected to grow as wafer-scale AI models, software, and hardware continue to mature. WaferLLM is open-sourced at https://github.com/MeshInfra/WaferLLM.

Large Language Models (LLMs) offer transformative capabilities for hardware design automation, particularly in Verilog code generation. However, they also pose significant data security challenges, including Verilog evaluation data contamination, intellectual property (IP) design leakage, and the risk of malicious Verilog generation. We introduce SALAD, a comprehensive assessment that leverages machine unlearning to mitigate these threats. Our approach enables the selective removal of contaminated benchmarks, sensitive IP and design artifacts, or malicious code patterns from pre-trained LLMs, all without requiring full retraining. Through detailed case studies, we demonstrate how machine unlearning techniques effectively reduce data security risks in LLM-aided hardware design.

The emergence of new nanoscale technologies has imposed significant challenges to designing reliable electronic systems in radiation environments. A few types of radiation like Total Ionizing Dose (TID) effects often cause permanent damages on such nanoscale electronic devices, and current state-of-the-art technologies to tackle TID make use of expensive radiation-hardened devices. This paper focuses on a novel and different approach: using machine learning algorithms on consumer electronic level Field Programmable Gate Arrays (FPGAs) to tackle TID effects and monitor them to replace before they stop working. This condition has a research challenge to anticipate when the board results in a total failure due to TID effects. We observed internal measurements of the FPGA boards under gamma radiation and used three different anomaly detection machine learning (ML) algorithms to detect anomalies in the sensor measurements in a gamma-radiated environment. The statistical results show a highly significant relationship between the gamma radiation exposure levels and the board measurements. Moreover, our anomaly detection results have shown that a One-Class Support Vector Machine with Radial Basis Function Kernel has an average Recall score of 0.95. Also, all anomalies can be detected before the boards stop working.

A flow control system is a critical concept for increasing the production capacity of manufacturing systems. To solve the scheduling optimization problem related to the flow control with the aim of improving productivity, existing methods depend on a heuristic design by domain human experts. Therefore, the methods require correction, monitoring, and verification by using real equipment. As system designs increase in complexity, the monitoring time increases, which decreases the probability of arriving at the optimal design. As an alternative approach to the heuristic design of flow control systems, the use of deep reinforcement learning to solve the scheduling optimization problem has been considered. Although the existing research on reinforcement learning has yielded excellent performance in some areas, the applicability of the results to actual FAB such as display and semiconductor manufacturing processes is not evident so far. To this end, we propose a method to implement a physical simulation environment and devise a feasible flow control system design using a transfer robot in display manufacturing through reinforcement learning. We present a model and parameter setting to build a virtual environment for different display transfer robots, and training methods of reinforcement learning on the environment to obtain an optimal scheduling of glass flow control systems. Its feasibility was verified by using different types of robots used in the actual process.

As the ubiquity and complexity of system-on-chip (SoC) designs increase across electronic devices, the task of incorporating security into an SoC design flow poses significant challenges. Existing security solutions are inadequate to provide effective verification of modern SoC designs due to their limitations in scalability, comprehensiveness, and adaptability. On the other hand, Large Language Models (LLMs) are celebrated for their remarkable success in natural language understanding, advanced reasoning, and program synthesis tasks. Recognizing an opportunity, our research delves into leveraging the emergent capabilities of Generative Pre-trained Transformers (GPTs) to address the existing gaps in SoC security, aiming for a more efficient, scalable, and adaptable methodology. By integrating LLMs into the SoC security verification paradigm, we open a new frontier of possibilities and challenges to ensure the security of increasingly complex SoCs. This paper offers an in-depth analysis of existing works, showcases practical case studies, demonstrates comprehensive experiments, and provides useful promoting guidelines. We also present the achievements, prospects, and challenges of employing LLM in different SoC security verification tasks.

In this work we investigate the ability of large language models to predict additive manufacturing defect regimes given a set of process parameter inputs. For this task we utilize a process parameter defect dataset to fine-tune a collection of models, titled AdditiveLLM, for the purpose of predicting potential defect regimes including Keyholing, Lack of Fusion, and Balling. We compare different methods of input formatting in order to gauge the model's performance to correctly predict defect regimes on our sparse Baseline dataset and our natural language Prompt dataset. The model displays robust predictive capability, achieving an accuracy of 93\% when asked to provide the defect regimes associated with a set of process parameters. The incorporation of natural language input further simplifies the task of process parameters selection, enabling users to identify optimal settings specific to their build.

ChipNeMo aims to explore the applications of large language models (LLMs) for industrial chip design. Instead of directly deploying off-the-shelf commercial or open-source LLMs, we instead adopt the following domain adaptation techniques: custom tokenizers, domain-adaptive continued pretraining, supervised fine-tuning (SFT) with domain-specific instructions, and domain-adapted retrieval models. We evaluate these methods on three selected LLM applications for chip design: an engineering assistant chatbot, EDA script generation, and bug summarization and analysis. Our results show that these domain adaptation techniques enable significant LLM performance improvements over general-purpose base models across the three evaluated applications, enabling up to 5x model size reduction with similar or better performance on a range of design tasks. Our findings also indicate that there's still room for improvement between our current results and ideal outcomes. We believe that further investigation of domain-adapted LLM approaches will help close this gap in the future.

Exponential increases in scientific experimental data are outstripping the rate of progress in silicon technology. As a result, heterogeneous combinations of architectures and process or device technologies are increasingly important to meet the computing demands of future scientific experiments. However, the complexity of heterogeneous computing systems requires systematic modeling to understand performance. We present a model which addresses this need by framing key aspects of data collection pipelines and constraints, and combines them with the important vectors of technology that shape alternatives, computing metrics that allow complex alternatives to be compared. For instance, a data collection pipeline may be characterized by parameters such as sensor sampling rates, amount of data collected, and the overall relevancy of retrieved samples. Alternatives to this pipeline are enabled by hardware development vectors including advancing CMOS, GPUs, neuromorphic computing, and edge computing. By calculating metrics for each alternative such as overall F1 score, power, hardware cost, and energy expended per relevant sample, this model allows alternate data collection systems to be rigorously compared. To demonstrate this model's capability, we apply it to the CMS experiment (and planned HL-LHC upgrade) to evaluate and compare the application of novel technologies in the data acquisition system (DAQ). We demonstrate that improvements to early stages in the DAQ are highly beneficial, greatly reducing the resources required at later stages of processing (such as a 60% power reduction) and increasing the amount of relevant data retrieved from the experiment per unit power (improving from 0.065 to 0.31 samples/kJ) However, we predict further advances will be required in order to meet overall power and cost constraints for the DAQ.

We introduce neural lithography to address the 'design-to-manufacturing' gap in computational optics. Computational optics with large design degrees of freedom enable advanced functionalities and performance beyond traditional optics. However, the existing design approaches often overlook the numerical modeling of the manufacturing process, which can result in significant performance deviation between the design and the fabricated optics. To bridge this gap, we, for the first time, propose a fully differentiable design framework that integrates a pre-trained photolithography simulator into the model-based optical design loop. Leveraging a blend of physics-informed modeling and data-driven training using experimentally collected datasets, our photolithography simulator serves as a regularizer on fabrication feasibility during design, compensating for structure discrepancies introduced in the lithography process. We demonstrate the effectiveness of our approach through two typical tasks in computational optics, where we design and fabricate a holographic optical element (HOE) and a multi-level diffractive lens (MDL) using a two-photon lithography system, showcasing improved optical performance on the task-specific metrics.

This paper presents LLM4SecHW, a novel framework for hardware debugging that leverages domain specific Large Language Model (LLM). Despite the success of LLMs in automating various software development tasks, their application in the hardware security domain has been limited due to the constraints of commercial LLMs and the scarcity of domain specific data. To address these challenges, we propose a unique approach to compile a dataset of open source hardware design defects and their remediation steps, utilizing version control data. This dataset provides a substantial foundation for training machine learning models for hardware. LLM4SecHW employs fine tuning of medium sized LLMs based on this dataset, enabling the identification and rectification of bugs in hardware designs. This pioneering approach offers a reference workflow for the application of fine tuning domain specific LLMs in other research areas. We evaluate the performance of our proposed system on various open source hardware designs, demonstrating its efficacy in accurately identifying and correcting defects. Our work brings a new perspective on automating the quality control process in hardware design.

The rapid advancement of Large Language Models (LLMs) has established language as a core general-purpose cognitive substrate, driving the demand for specialized Language Processing Units (LPUs) tailored for LLM inference. To overcome the growing energy consumption of LLM inference systems, this paper proposes a Hardwired-Neurons Language Processing Unit (HNLPU), which physically hardwires LLM weight parameters into the computational fabric, achieving several orders of magnitude computational efficiency improvement by extreme specialization. However, a significant challenge still lies in the scale of modern LLMs. An ideal estimation on hardwiring gpt-oss 120 B requires fabricating at least 6 billion dollars of photomask sets, rendering the straightforward solution economically impractical. Addressing this challenge, we propose the novel Metal-Embedding methodology. Instead of embedding weights in a 2D grid of silicon device cells, Metal-Embedding embeds weight parameters into the 3D topology of metal wires. This brings two benefits: (1) a 15x increase in density, and (2) 60 out of 70 layers of photomasks are made homogeneous across chips, including all EUV photomasks. In total, Metal-Embedding reduced the photomask cost by 112x, bringing the Non-Recurring Engineering (NRE) cost of HNLPU into an economically viable range. Experimental results show that HNLPU achieved 249,960 tokens/s (5,555x/85x of GPU/WSE), 36 tokens/J (1,047x/283x of GPU/WSE), 13,232 mm2 total die area (29% inscribed rectangular area in a 300 mm wafer), \$184M estimated NRE at 5 nm technology. Analysis shows that HNLPU achieved 8.57x cost-effectiveness and 230x carbon footprint reduction compared to H100 clusters, under an annual weight updating assumption.

Large language models (LLMs) have emerged due to their capability to generate high-quality content across diverse contexts. To reduce their explosively increasing demands for computing resources, a mixture of experts (MoE) has emerged. The MoE layer enables exploiting a huge number of parameters with less computation. Applying state-of-the-art continuous batching increases throughput; however, it leads to frequent DRAM access in the MoE and attention layers. We observe that conventional computing devices have limitations when processing the MoE and attention layers, which dominate the total execution time and exhibit low arithmetic intensity (Op/B). Processing MoE layers only with devices targeting low-Op/B such as processing-in-memory (PIM) architectures is challenging due to the fluctuating Op/B in the MoE layer caused by continuous batching. To address these challenges, we propose Duplex, which comprises xPU tailored for high-Op/B and Logic-PIM to effectively perform low-Op/B operation within a single device. Duplex selects the most suitable processor based on the Op/B of each layer within LLMs. As the Op/B of the MoE layer is at least 1 and that of the attention layer has a value of 4-8 for grouped query attention, prior PIM architectures are not efficient, which place processing units inside DRAM dies and only target extremely low-Op/B (under one) operations. Based on recent trends, Logic-PIM adds more through-silicon vias (TSVs) to enable high-bandwidth communication between the DRAM die and the logic die and place powerful processing units on the logic die, which is best suited for handling low-Op/B operations ranging from few to a few dozens. To maximally utilize the xPU and Logic-PIM, we propose expert and attention co-processing.

Recently, with the development of tool-calling capabilities in large language models (LLMs), these models have demonstrated significant potential for automating electronic design automation (EDA) flows by interacting with EDA tool APIs via EDA scripts. However, considering the limited understanding of EDA tools, LLMs face challenges in practical scenarios where diverse interfaces of EDA tools exist across different platforms. Additionally, EDA flow automation often involves intricate, long-chain tool-calling processes, increasing the likelihood of errors in intermediate steps. Any errors will lead to the instability and failure of EDA flow automation. To address these challenges, we introduce EDAid, a multi-agent collaboration system where multiple agents harboring divergent thoughts converge towards a common goal, ensuring reliable and successful EDA flow automation. Specifically, each agent is controlled by ChipLlama models, which are expert LLMs fine-tuned for EDA flow automation. Our experiments demonstrate the state-of-the-art (SOTA) performance of our ChipLlama models and validate the effectiveness of our EDAid in the automation of complex EDA flows, showcasing superior performance compared to single-agent systems.

In this paper, we introduce an approach for detecting modifications in assembled printed circuit boards based on photographs taken without tight control over perspective and illumination conditions. One instance of this problem is the visual inspection of gas pumps PCBs, which can be modified by fraudsters wishing to deceive costumers or evade taxes. Given the uncontrolled environment and the huge number of possible modifications, we address the problem as a case of anomaly detection, proposing an approach that is directed towards the characteristics of that scenario, while being well-suited for other similar applications. The proposed approach employs a deep convolutional autoencoder trained to reconstruct images of an unmodified board, but which remains unable to do the same for images showing modifications. By comparing the input image with its reconstruction, it is possible to segment anomalies and modifications in a pixel-wise manner. Experiments performed on a dataset built to represent real-world situations (and which we will make publicly available) show that our approach outperforms other state-of-the-art approaches for anomaly segmentation in the considered scenario, while producing comparable results on the popular MVTec-AD dataset for a more general object anomaly detection task.